Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    272-6325-9UA-1902

    272-6325-9UA-1902

    TEST BURN-IN PGA

    3M

    2,404
    RFQ
    272-6325-9UA-1902

    Datasheet

    272-6325-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 72 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2184-6325-9UA-1902

    2184-6325-9UA-1902

    TEST BURN-IN PGA

    3M

    2,687
    RFQ
    2184-6325-9UA-1902

    Datasheet

    2184-6325-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 184 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2141-6321-9UA-1902

    2141-6321-9UA-1902

    TEST AND BURN-IN PGA

    3M

    4,225
    RFQ
    2141-6321-9UA-1902

    Datasheet

    2141-6321-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 141 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2192-6325-9UA-1902

    2192-6325-9UA-1902

    TEST BURN-IN PGA

    3M

    2,064
    RFQ
    2192-6325-9UA-1902

    Datasheet

    2192-6325-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 192 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2280-6319-9UA-1902

    2280-6319-9UA-1902

    TEXTOOL

    3M

    4,640
    RFQ
    2280-6319-9UA-1902

    Datasheet

    2280-6319-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 280 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2145-6315-9UA-1902

    2145-6315-9UA-1902

    BURN-IN GRID ZIP SOCKET

    3M

    3,015
    RFQ
    2145-6315-9UA-1902

    Datasheet

    2145-6315-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    256-6313-9UA-1902

    256-6313-9UA-1902

    PGA 13 X 13

    3M

    2,153
    RFQ
    256-6313-9UA-1902

    Datasheet

    256-6313-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 56 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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