Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    1035-2-1152-0B-00

    1035-2-1152-0B-00

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    2,825
    RFQ

    -

    1035-2-1152-0B-00 - Bulk Active - - - - - - - - - - - - - - -
    1025-2-0572-0B-00

    1025-2-0572-0B-00

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    3,789
    RFQ

    -

    1025-2-0572-0B-00 - Bulk Active - - - - - - - - - - - - - - -
    79300-20-009

    79300-20-009

    3M TEXTOOL FLEXIBLE ARRAY SOLUTI

    3M

    3,952
    RFQ

    -

    79300-20-009 Textool™ Bulk Obsolete - - - - - - - - - - - - - - -
    7100287881

    7100287881

    TEXTOOLFLEXIBLE ARRAY SOLUTIONS

    3M

    3,985
    RFQ

    -

    7100287881 - Bulk Active - - - - - - - - - - - - - - -
    7010390893

    7010390893

    983-10 DOT IN-LN2"ES 6"X150YD-IN

    3M

    3,070
    RFQ

    -

    7010390893 - Bulk Active - - - - - - - - - - - - - - -
    216-6278-00-3303

    216-6278-00-3303

    CONN IC DIP SOCKET ZIF 16POS GLD

    3M

    3,971
    RFQ
    216-6278-00-3303

    Datasheet

    216-6278-00-3303 OEM Tube Obsolete DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled -55°C ~ 105°C
    232-1297-00-3303

    232-1297-00-3303

    CONN IC DIP SOCKET ZIF 32POS GLD

    3M

    3,583
    RFQ
    232-1297-00-3303

    Datasheet

    232-1297-00-3303 OEM Tube Obsolete DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled -55°C ~ 105°C
    218-7223-55-1902

    218-7223-55-1902

    CONN SOCKET SOIC 18POS GOLD

    3M

    2,380
    RFQ
    218-7223-55-1902

    Datasheet

    218-7223-55-1902 Textool™ Bulk Active SOIC 18 (2 x 9) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
    200-6310-9UN-1900

    200-6310-9UN-1900

    CONN SOCKET PGA ZIF 100POS GOLD

    3M

    4,944
    RFQ
    200-6310-9UN-1900

    Datasheet

    200-6310-9UN-1900 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    200-6311-9UN-1900

    200-6311-9UN-1900

    CONN SOCKET PGA ZIF 121POS GOLD

    3M

    3,584
    RFQ
    200-6311-9UN-1900

    Datasheet

    200-6311-9UN-1900 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    Total 327 Record«Prev1... 2122232425262728...33Next»
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