Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    2255-929A-90-2401

    2255-929A-90-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    2,348
    RFQ

    -

    2255-929A-90-2401 - Bulk Obsolete - - - - - - - - - - - - - - -
    2320-9220-02-2401

    2320-9220-02-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    3,921
    RFQ

    -

    2320-9220-02-2401 - Bulk Obsolete - - - - - - - - - - - - - - -
    2432-9235-01-2401

    2432-9235-01-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    4,562
    RFQ

    -

    2432-9235-01-2401 - Bulk Obsolete - - - - - - - - - - - - - - -
    2256-6321-9UA-1902

    2256-6321-9UA-1902

    GRID ZIP 21 X 21

    3M

    3,048
    RFQ
    2256-6321-9UA-1902

    Datasheet

    2256-6321-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 256 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    276-6321-9UA-1902

    276-6321-9UA-1902

    TEST BURN-IN PGA

    3M

    2,554
    RFQ
    276-6321-9UA-1902

    Datasheet

    276-6321-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 76 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2124-6313-9UA-1902

    2124-6313-9UA-1902

    TEST BURN-IN PGA

    3M

    4,626
    RFQ
    2124-6313-9UA-1902

    Datasheet

    2124-6313-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 124 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2209-6317-9UA-1902

    2209-6317-9UA-1902

    GRID ZIP

    3M

    4,468
    RFQ
    2209-6317-9UA-1902

    Datasheet

    2209-6317-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 209 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2225-6317-9UA-1902

    2225-6317-9UA-1902

    TEXTOOL

    3M

    3,464
    RFQ
    2225-6317-9UA-1902

    Datasheet

    2225-6317-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2120-6313-9UA-1902

    2120-6313-9UA-1902

    PGA 13 X13

    3M

    4,915
    RFQ
    2120-6313-9UA-1902

    Datasheet

    2120-6313-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 120 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2361-6319-9UA-1902

    2361-6319-9UA-1902

    GRID ZIP 19 X 19

    3M

    3,186
    RFQ
    2361-6319-9UA-1902

    Datasheet

    2361-6319-9UA-1902 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 361 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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