Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-93-316-41-001000

    116-93-316-41-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    4,534
    RFQ
    116-93-316-41-001000

    Datasheet

    116-93-316-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    316-93-120-41-008000

    316-93-120-41-008000

    SOCKET ELEVATED SIP 20POS

    Mill-Max Manufacturing Corp.

    4,946
    RFQ
    316-93-120-41-008000

    Datasheet

    316-93-120-41-008000 316 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-316-41-001000

    116-43-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,132
    RFQ
    116-43-316-41-001000

    Datasheet

    116-43-316-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    323-93-120-41-001000

    323-93-120-41-001000

    SOCKET 3 LEVEL WRAPOST SIP 20POS

    Mill-Max Manufacturing Corp.

    4,819
    RFQ
    323-93-120-41-001000

    Datasheet

    323-93-120-41-001000 323 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-324-41-001000

    116-47-324-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    3,702
    RFQ
    116-47-324-41-001000

    Datasheet

    116-47-324-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-424-41-001000

    116-47-424-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,054
    RFQ
    116-47-424-41-001000

    Datasheet

    116-47-424-41-001000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-624-41-001000

    116-47-624-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,159
    RFQ
    116-47-624-41-001000

    Datasheet

    116-47-624-41-001000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6518-01

    48-6518-01

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    4,635
    RFQ
    48-6518-01

    Datasheet

    48-6518-01 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APA-318-G-P

    APA-318-G-P

    ADAPTER PLUG

    Samtec Inc.

    2,699
    RFQ
    APA-318-G-P

    Datasheet

    APA-318-G-P APA Tube Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    550-80-132-14-071101

    550-80-132-14-071101

    PGA SOLDER TAIL

    Preci-Dip

    3,589
    RFQ
    550-80-132-14-071101

    Datasheet

    550-80-132-14-071101 550 Bulk Active PGA 132 (14 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-80-132-13-041101

    550-80-132-13-041101

    PGA SOLDER TAIL

    Preci-Dip

    4,848
    RFQ
    550-80-132-13-041101

    Datasheet

    550-80-132-13-041101 550 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    346-93-162-41-013000

    346-93-162-41-013000

    CONN SOCKET SIP 62POS GOLD

    Mill-Max Manufacturing Corp.

    2,477
    RFQ
    346-93-162-41-013000

    Datasheet

    346-93-162-41-013000 346 Bulk Active SIP 62 (1 x 62) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-162-41-013000

    346-43-162-41-013000

    CONN SOCKET SIP 62POS GOLD

    Mill-Max Manufacturing Corp.

    4,835
    RFQ
    346-43-162-41-013000

    Datasheet

    346-43-162-41-013000 346 Bulk Active SIP 62 (1 x 62) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-642-41-006000

    116-47-642-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,750
    RFQ
    116-47-642-41-006000

    Datasheet

    116-47-642-41-006000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-316-41-001000

    612-93-316-41-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    3,242
    RFQ
    612-93-316-41-001000

    Datasheet

    612-93-316-41-001000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-316-41-001000

    612-43-316-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,960
    RFQ
    612-43-316-41-001000

    Datasheet

    612-43-316-41-001000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6556-20

    24-6556-20

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,073
    RFQ
    24-6556-20

    Datasheet

    24-6556-20 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    24-6556-30

    24-6556-30

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,483
    RFQ
    24-6556-30

    Datasheet

    24-6556-30 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    42-6556-10

    42-6556-10

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    2,201
    RFQ
    42-6556-10

    Datasheet

    42-6556-10 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    116-93-328-41-006000

    116-93-328-41-006000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,550
    RFQ
    116-93-328-41-006000

    Datasheet

    116-93-328-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 608609610611612613614615...955Next»
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