Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1724-T-H

    APH-1724-T-H

    APH-1724-T-H

    Samtec Inc.

    3,125
    RFQ

    -

    APH-1724-T-H * - Active - - - - - - - - - - - - - - -
    APH-0724-T-H

    APH-0724-T-H

    APH-0724-T-H

    Samtec Inc.

    4,150
    RFQ

    -

    APH-0724-T-H * - Active - - - - - - - - - - - - - - -
    APH-0824-T-H

    APH-0824-T-H

    APH-0824-T-H

    Samtec Inc.

    3,380
    RFQ

    -

    APH-0824-T-H * - Active - - - - - - - - - - - - - - -
    714-93-120-41-001000

    714-93-120-41-001000

    SOCKET CARRIER SIP 20POS

    Mill-Max Manufacturing Corp.

    2,446
    RFQ
    714-93-120-41-001000

    Datasheet

    714-93-120-41-001000 714 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-640-ZWGT-2

    ICA-640-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,089
    RFQ
    ICA-640-ZWGT-2

    Datasheet

    ICA-640-ZWGT-2 ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    28-81000-610C

    28-81000-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,109
    RFQ
    28-81000-610C

    Datasheet

    28-81000-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-81010-610C

    28-81010-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,276
    RFQ
    28-81010-610C

    Datasheet

    28-81010-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-81250-610C

    28-81250-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,055
    RFQ
    28-81250-610C

    Datasheet

    28-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8240-610C

    28-8240-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,449
    RFQ
    28-8240-610C

    Datasheet

    28-8240-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8250-610C

    28-8250-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,078
    RFQ
    28-8250-610C

    Datasheet

    28-8250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8300-610C

    28-8300-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,045
    RFQ
    28-8300-610C

    Datasheet

    28-8300-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8370-610C

    28-8370-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,986
    RFQ
    28-8370-610C

    Datasheet

    28-8370-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8375-610C

    28-8375-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,798
    RFQ
    28-8375-610C

    Datasheet

    28-8375-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8400-610C

    28-8400-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,033
    RFQ
    28-8400-610C

    Datasheet

    28-8400-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8459-610C

    28-8459-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,770
    RFQ
    28-8459-610C

    Datasheet

    28-8459-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8472-610C

    28-8472-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,750
    RFQ
    28-8472-610C

    Datasheet

    28-8472-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8495-610C

    28-8495-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,440
    RFQ
    28-8495-610C

    Datasheet

    28-8495-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8500-610C

    28-8500-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,954
    RFQ
    28-8500-610C

    Datasheet

    28-8500-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8600-610C

    28-8600-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,446
    RFQ
    28-8600-610C

    Datasheet

    28-8600-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8620-610C

    28-8620-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,367
    RFQ
    28-8620-610C

    Datasheet

    28-8620-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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