Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    123-47-632-41-001000

    123-47-632-41-001000

    STANDARD WIRE WRAP DBL SKT

    Mill-Max Manufacturing Corp.

    4,098
    RFQ
    123-47-632-41-001000

    Datasheet

    123-47-632-41-001000 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    35-71000-10

    35-71000-10

    CONN SOCKET SIP 35POS TIN

    Aries Electronics

    2,864
    RFQ
    35-71000-10

    Datasheet

    35-71000-10 700 Elevator Strip-Line™ Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    35-7360-10

    35-7360-10

    CONN SOCKET SIP 35POS TIN

    Aries Electronics

    3,028
    RFQ
    35-7360-10

    Datasheet

    35-7360-10 700 Elevator Strip-Line™ Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    124-93-318-41-002000

    124-93-318-41-002000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    4,546
    RFQ
    124-93-318-41-002000

    Datasheet

    124-93-318-41-002000 124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-43-318-41-002000

    124-43-318-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,648
    RFQ
    124-43-318-41-002000

    Datasheet

    124-43-318-41-002000 124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-820-90C

    40-820-90C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,598
    RFQ
    40-820-90C

    Datasheet

    40-820-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-822-90C

    40-822-90C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,049
    RFQ
    40-822-90C

    Datasheet

    40-822-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-41-324-41-004000

    612-41-324-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,447
    RFQ
    612-41-324-41-004000

    Datasheet

    612-41-324-41-004000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-424-41-004000

    612-41-424-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,090
    RFQ
    612-41-424-41-004000

    Datasheet

    612-41-424-41-004000 612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-624-41-004000

    612-41-624-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,107
    RFQ
    612-41-624-41-004000

    Datasheet

    612-41-624-41-004000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-324-41-004000

    612-91-324-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,267
    RFQ
    612-91-324-41-004000

    Datasheet

    612-91-324-41-004000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-424-41-004000

    612-91-424-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,013
    RFQ
    612-91-424-41-004000

    Datasheet

    612-91-424-41-004000 612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-624-41-004000

    612-91-624-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,265
    RFQ
    612-91-624-41-004000

    Datasheet

    612-91-624-41-004000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-9503-20

    32-9503-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,282
    RFQ
    32-9503-20

    Datasheet

    32-9503-20 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-322-41-003000

    126-41-322-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,618
    RFQ
    126-41-322-41-003000

    Datasheet

    126-41-322-41-003000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-422-41-003000

    126-41-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,247
    RFQ
    126-41-422-41-003000

    Datasheet

    126-41-422-41-003000 126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-322-41-003000

    126-91-322-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,377
    RFQ
    126-91-322-41-003000

    Datasheet

    126-91-322-41-003000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-422-41-003000

    126-91-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,145
    RFQ
    126-91-422-41-003000

    Datasheet

    126-91-422-41-003000 126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-432-41-008000

    116-41-432-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,596
    RFQ
    116-41-432-41-008000

    Datasheet

    116-41-432-41-008000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-632-41-008000

    116-41-632-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,541
    RFQ
    116-41-632-41-008000

    Datasheet

    116-41-632-41-008000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 645646647648649650651652...955Next»
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