Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    517-83-280-18-101111

    517-83-280-18-101111

    CONN SOCKET PGA 280POS GOLD

    Preci-Dip

    3,926
    RFQ
    517-83-280-18-101111

    Datasheet

    517-83-280-18-101111 517 Bulk Active PGA 280 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-1414-G-H

    APH-1414-G-H

    APH-1414-G-H

    Samtec Inc.

    4,593
    RFQ

    -

    APH-1414-G-H * - Active - - - - - - - - - - - - - - -
    APH-0514-G-H

    APH-0514-G-H

    APH-0514-G-H

    Samtec Inc.

    3,187
    RFQ

    -

    APH-0514-G-H * - Active - - - - - - - - - - - - - - -
    APH-0614-G-H

    APH-0614-G-H

    APH-0614-G-H

    Samtec Inc.

    3,153
    RFQ

    -

    APH-0614-G-H * - Active - - - - - - - - - - - - - - -
    APH-0714-G-H

    APH-0714-G-H

    APH-0714-G-H

    Samtec Inc.

    4,206
    RFQ

    -

    APH-0714-G-H * - Active - - - - - - - - - - - - - - -
    APH-1614-G-H

    APH-1614-G-H

    APH-1614-G-H

    Samtec Inc.

    3,570
    RFQ

    -

    APH-1614-G-H * - Active - - - - - - - - - - - - - - -
    APH-0314-G-H

    APH-0314-G-H

    APH-0314-G-H

    Samtec Inc.

    3,234
    RFQ

    -

    APH-0314-G-H * - Active - - - - - - - - - - - - - - -
    122-13-318-41-801000

    122-13-318-41-801000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    3,459
    RFQ
    122-13-318-41-801000

    Datasheet

    122-13-318-41-801000 122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-650-41-001000

    123-91-650-41-001000

    SOCKET IC OPEN 3 LVL .600 50POS

    Mill-Max Manufacturing Corp.

    2,593
    RFQ

    -

    123-91-650-41-001000 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-650-41-001000

    123-41-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,587
    RFQ
    123-41-650-41-001000

    Datasheet

    123-41-650-41-001000 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-328-41-001000

    612-13-328-41-001000

    SOCKET CARRIER SLDRTL .300 28POS

    Mill-Max Manufacturing Corp.

    2,158
    RFQ
    612-13-328-41-001000

    Datasheet

    612-13-328-41-001000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-428-41-001000

    612-13-428-41-001000

    SOCKET CARRIER SLDRTL .400 28POS

    Mill-Max Manufacturing Corp.

    4,026
    RFQ
    612-13-428-41-001000

    Datasheet

    612-13-428-41-001000 612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-628-41-001000

    612-13-628-41-001000

    SOCKET CARRIER SLDRTL .600 28POS

    Mill-Max Manufacturing Corp.

    2,660
    RFQ
    612-13-628-41-001000

    Datasheet

    612-13-628-41-001000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-210-61-006000

    116-43-210-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,218
    RFQ

    -

    116-43-210-61-006000 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-210-61-006000

    116-93-210-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,109
    RFQ

    -

    116-93-210-61-006000 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    64-9518-10TE

    64-9518-10TE

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,892
    RFQ
    64-9518-10TE

    Datasheet

    64-9518-10TE 518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-43-432-41-004000

    612-43-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,134
    RFQ
    612-43-432-41-004000

    Datasheet

    612-43-432-41-004000 612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-632-41-004000

    612-43-632-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,994
    RFQ
    612-43-632-41-004000

    Datasheet

    612-43-632-41-004000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-432-41-004000

    612-93-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,570
    RFQ
    612-93-432-41-004000

    Datasheet

    612-93-432-41-004000 612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-632-41-004000

    612-93-632-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,870
    RFQ
    612-93-632-41-004000

    Datasheet

    612-93-632-41-004000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 729730731732733734735736...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER