Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    64-9518-11H

    64-9518-11H

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,811
    RFQ
    64-9518-11H

    Datasheet

    64-9518-11H 518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-93-314-61-801000

    110-93-314-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,168
    RFQ

    -

    110-93-314-61-801000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-652-41-770000

    104-11-652-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,410
    RFQ
    104-11-652-41-770000

    Datasheet

    104-11-652-41-770000 104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-306-61-001000

    116-43-306-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,541
    RFQ

    -

    116-43-306-61-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-624-61-003000

    115-44-624-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,480
    RFQ

    -

    115-44-624-61-003000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-3508-211

    24-3508-211

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,775
    RFQ
    24-3508-211

    Datasheet

    24-3508-211 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-3508-311

    24-3508-311

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,432
    RFQ
    24-3508-311

    Datasheet

    24-3508-311 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    240-4846-00-3303

    240-4846-00-3303

    CONN IC DIP SOCKET ZIF 40POS GLD

    3M

    2,839
    RFQ
    240-4846-00-3303

    Datasheet

    240-4846-00-3303 OEM Bulk Obsolete DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled -55°C ~ 105°C
    614-41-950-31-002000

    614-41-950-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,896
    RFQ
    614-41-950-31-002000

    Datasheet

    614-41-950-31-002000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-950-31-002000

    614-91-950-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,966
    RFQ
    614-91-950-31-002000

    Datasheet

    614-91-950-31-002000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-324-61-001000

    110-91-324-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,143
    RFQ

    -

    110-91-324-61-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-424-61-001000

    110-91-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,812
    RFQ

    -

    110-91-424-61-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-624-61-001000

    110-91-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,634
    RFQ

    -

    110-91-624-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-950-31-007000

    614-41-950-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,732
    RFQ
    614-41-950-31-007000

    Datasheet

    614-41-950-31-007000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-950-31-007000

    614-91-950-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,759
    RFQ
    614-91-950-31-007000

    Datasheet

    614-91-950-31-007000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-6621-30

    36-6621-30

    CONN IC DIP SOCKET 36POS TIN

    Aries Electronics

    2,601
    RFQ
    36-6621-30

    Datasheet

    36-6621-30 6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    144-PGM13095-10

    144-PGM13095-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,725
    RFQ
    144-PGM13095-10

    Datasheet

    144-PGM13095-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    517-87-411-20-111111

    517-87-411-20-111111

    CONN SOCKET PGA 411POS GOLD

    Preci-Dip

    3,820
    RFQ
    517-87-411-20-111111

    Datasheet

    517-87-411-20-111111 517 Bulk Active PGA 411 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    104-13-640-41-780000

    104-13-640-41-780000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    2,928
    RFQ
    104-13-640-41-780000

    Datasheet

    104-13-640-41-780000 104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    116-41-950-41-007000

    116-41-950-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,178
    RFQ
    116-41-950-41-007000

    Datasheet

    116-41-950-41-007000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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