Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    550-10-192M16-001166

    550-10-192M16-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,490
    RFQ
    550-10-192M16-001166

    Datasheet

    550-10-192M16-001166 550 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    614-41-952-41-001000

    614-41-952-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,091
    RFQ
    614-41-952-41-001000

    Datasheet

    614-41-952-41-001000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-952-41-001000

    614-91-952-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,986
    RFQ
    614-91-952-41-001000

    Datasheet

    614-91-952-41-001000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-81250-610C

    36-81250-610C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,657
    RFQ
    36-81250-610C

    Datasheet

    36-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-8580-610C

    36-8580-610C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,325
    RFQ
    36-8580-610C

    Datasheet

    36-8580-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-8750-310C

    36-8750-310C

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,655
    RFQ
    36-8750-310C

    Datasheet

    36-8750-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    104-11-652-41-780000

    104-11-652-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,300
    RFQ
    104-11-652-41-780000

    Datasheet

    104-11-652-41-780000 104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    416-93-264-41-006000

    416-93-264-41-006000

    SOCKET DUAL INLINE ELEVATD 64POS

    Mill-Max Manufacturing Corp.

    2,538
    RFQ
    416-93-264-41-006000

    Datasheet

    416-93-264-41-006000 416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - - -
    614-93-950-31-012000

    614-93-950-31-012000

    SOCKET CARRIER LOWPRO .900 50POS

    Mill-Max Manufacturing Corp.

    3,784
    RFQ
    614-93-950-31-012000

    Datasheet

    614-93-950-31-012000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-950-31-012000

    614-43-950-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,311
    RFQ
    614-43-950-31-012000

    Datasheet

    614-43-950-31-012000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-324-61-003000

    115-43-324-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,200
    RFQ

    -

    115-43-324-61-003000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-624-61-003000

    115-43-624-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,067
    RFQ

    -

    115-43-624-61-003000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-324-61-003000

    115-93-324-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,737
    RFQ

    -

    115-93-324-61-003000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-624-61-003000

    115-93-624-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,480
    RFQ

    -

    115-93-624-61-003000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-13-636-41-001000

    121-13-636-41-001000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    2,192
    RFQ
    121-13-636-41-001000

    Datasheet

    121-13-636-41-001000 121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-3574-10

    40-3574-10

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    4,517
    RFQ
    40-3574-10

    Datasheet

    40-3574-10 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-41-650-41-001000

    116-41-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,012
    RFQ
    116-41-650-41-001000

    Datasheet

    116-41-650-41-001000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-650-41-001000

    116-91-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,506
    RFQ
    116-91-650-41-001000

    Datasheet

    116-91-650-41-001000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-310-61-001000

    110-43-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,497
    RFQ

    -

    110-43-310-61-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-310-61-001000

    110-93-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,966
    RFQ

    -

    110-93-310-61-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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