Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1738-T-T

    APH-1738-T-T

    APH-1738-T-T

    Samtec Inc.

    2,480
    RFQ

    -

    APH-1738-T-T * - Active - - - - - - - - - - - - - - -
    612-41-650-41-001000

    612-41-650-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,587
    RFQ
    612-41-650-41-001000

    Datasheet

    612-41-650-41-001000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-650-41-001000

    612-91-650-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,496
    RFQ
    612-91-650-41-001000

    Datasheet

    612-91-650-41-001000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-3574-10

    48-3574-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    4,721
    RFQ
    48-3574-10

    Datasheet

    48-3574-10 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6570-10

    48-6570-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    2,119
    RFQ
    48-6570-10

    Datasheet

    48-6570-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    160-PGM15050-10

    160-PGM15050-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,427
    RFQ
    160-PGM15050-10

    Datasheet

    160-PGM15050-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-43-642-41-003000

    612-43-642-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,782
    RFQ
    612-43-642-41-003000

    Datasheet

    612-43-642-41-003000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-642-41-003000

    612-93-642-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,626
    RFQ
    612-93-642-41-003000

    Datasheet

    612-93-642-41-003000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-210-61-001000

    116-43-210-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,787
    RFQ

    -

    116-43-210-61-001000 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    85-PGM11007-11H

    85-PGM11007-11H

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,055
    RFQ
    85-PGM11007-11H

    Datasheet

    85-PGM11007-11H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-13-632-41-801000

    110-13-632-41-801000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    4,912
    RFQ
    110-13-632-41-801000

    Datasheet

    110-13-632-41-801000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-648-41-001000

    126-93-648-41-001000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    4,399
    RFQ
    126-93-648-41-001000

    Datasheet

    126-93-648-41-001000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-648-41-001000

    126-43-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,258
    RFQ
    126-43-648-41-001000

    Datasheet

    126-43-648-41-001000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-952-11-480000

    605-93-952-11-480000

    SOCKET CARRIER LOWPRO .900 52POS

    Mill-Max Manufacturing Corp.

    2,093
    RFQ
    605-93-952-11-480000

    Datasheet

    605-93-952-11-480000 605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-952-11-480000

    605-43-952-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,688
    RFQ
    605-43-952-11-480000

    Datasheet

    605-43-952-11-480000 605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-642-41-003000

    126-41-642-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,164
    RFQ
    126-41-642-41-003000

    Datasheet

    126-41-642-41-003000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-642-41-003000

    126-91-642-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,756
    RFQ
    126-91-642-41-003000

    Datasheet

    126-91-642-41-003000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-324-61-001000

    115-43-324-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,285
    RFQ

    -

    115-43-324-61-001000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-424-61-001000

    115-43-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,157
    RFQ

    -

    115-43-424-61-001000 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-624-61-001000

    115-43-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,933
    RFQ

    -

    115-43-624-61-001000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 752753754755756757758759...955Next»
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