Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1438-G-H

    APH-1438-G-H

    APH-1438-G-H

    Samtec Inc.

    4,649
    RFQ

    -

    APH-1438-G-H * - Active - - - - - - - - - - - - - - -
    APH-0538-G-H

    APH-0538-G-H

    APH-0538-G-H

    Samtec Inc.

    2,630
    RFQ

    -

    APH-0538-G-H * - Active - - - - - - - - - - - - - - -
    APH-1938-G-H

    APH-1938-G-H

    APH-1938-G-H

    Samtec Inc.

    3,198
    RFQ

    -

    APH-1938-G-H * - Active - - - - - - - - - - - - - - -
    APH-1538-G-H

    APH-1538-G-H

    APH-1538-G-H

    Samtec Inc.

    3,101
    RFQ

    -

    APH-1538-G-H * - Active - - - - - - - - - - - - - - -
    APH-0838-G-H

    APH-0838-G-H

    APH-0838-G-H

    Samtec Inc.

    3,911
    RFQ

    -

    APH-0838-G-H * - Active - - - - - - - - - - - - - - -
    APH-1638-G-H

    APH-1638-G-H

    APH-1638-G-H

    Samtec Inc.

    2,254
    RFQ

    -

    APH-1638-G-H * - Active - - - - - - - - - - - - - - -
    APH-1238-G-H

    APH-1238-G-H

    APH-1238-G-H

    Samtec Inc.

    3,536
    RFQ

    -

    APH-1238-G-H * - Active - - - - - - - - - - - - - - -
    APH-0738-G-H

    APH-0738-G-H

    APH-0738-G-H

    Samtec Inc.

    2,919
    RFQ

    -

    APH-0738-G-H * - Active - - - - - - - - - - - - - - -
    APH-0238-G-H

    APH-0238-G-H

    APH-0238-G-H

    Samtec Inc.

    4,985
    RFQ

    -

    APH-0238-G-H * - Active - - - - - - - - - - - - - - -
    APH-0338-G-H

    APH-0338-G-H

    APH-0338-G-H

    Samtec Inc.

    2,170
    RFQ

    -

    APH-0338-G-H * - Active - - - - - - - - - - - - - - -
    APH-0638-G-H

    APH-0638-G-H

    APH-0638-G-H

    Samtec Inc.

    2,893
    RFQ

    -

    APH-0638-G-H * - Active - - - - - - - - - - - - - - -
    42-6570-11

    42-6570-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    2,954
    RFQ
    42-6570-11

    Datasheet

    42-6570-11 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6573-11

    42-6573-11

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,092
    RFQ
    42-6573-11

    Datasheet

    42-6573-11 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    514-83-256M16-000148

    514-83-256M16-000148

    CONN SOCKET BGA 256POS GOLD

    Preci-Dip

    3,600
    RFQ
    514-83-256M16-000148

    Datasheet

    514-83-256M16-000148 514 Bulk Active BGA 256 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-83-256M20-001148

    514-83-256M20-001148

    CONN SOCKET BGA 256POS GOLD

    Preci-Dip

    3,725
    RFQ
    514-83-256M20-001148

    Datasheet

    514-83-256M20-001148 514 Bulk Active BGA 256 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-299-20-001112

    614-87-299-20-001112

    CONN SOCKET PGA 299POS GOLD

    Preci-Dip

    2,824
    RFQ
    614-87-299-20-001112

    Datasheet

    614-87-299-20-001112 614 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-91-209-17-081003

    510-91-209-17-081003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    3,941
    RFQ
    510-91-209-17-081003

    Datasheet

    510-91-209-17-081003 510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    120-PGM13015-40

    120-PGM13015-40

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,238
    RFQ
    120-PGM13015-40

    Datasheet

    120-PGM13015-40 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-238-19-101112

    614-83-238-19-101112

    CONN SOCKET PGA 238POS GOLD

    Preci-Dip

    2,367
    RFQ
    614-83-238-19-101112

    Datasheet

    614-83-238-19-101112 614 Bulk Active PGA 238 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    133-PGM14014-40

    133-PGM14014-40

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,118
    RFQ
    133-PGM14014-40

    Datasheet

    133-PGM14014-40 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 861862863864865866867868...955Next»
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