Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0632-G-T

    APH-0632-G-T

    APH-0632-G-T

    Samtec Inc.

    4,430
    RFQ

    -

    APH-0632-G-T * - Active - - - - - - - - - - - - - - -
    APH-1332-G-T

    APH-1332-G-T

    APH-1332-G-T

    Samtec Inc.

    3,250
    RFQ

    -

    APH-1332-G-T * - Active - - - - - - - - - - - - - - -
    APH-0732-G-T

    APH-0732-G-T

    APH-0732-G-T

    Samtec Inc.

    3,958
    RFQ

    -

    APH-0732-G-T * - Active - - - - - - - - - - - - - - -
    APH-1132-G-T

    APH-1132-G-T

    APH-1132-G-T

    Samtec Inc.

    2,042
    RFQ

    -

    APH-1132-G-T * - Active - - - - - - - - - - - - - - -
    116-43-950-61-001000

    116-43-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,332
    RFQ

    -

    116-43-950-61-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-61-001000

    116-93-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,536
    RFQ

    -

    116-93-950-61-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6554-16

    32-6554-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    2,686
    RFQ
    32-6554-16

    Datasheet

    32-6554-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APH-0430-G-R

    APH-0430-G-R

    APH-0430-G-R

    Samtec Inc.

    3,821
    RFQ

    -

    APH-0430-G-R * - Active - - - - - - - - - - - - - - -
    APH-1830-G-R

    APH-1830-G-R

    APH-1830-G-R

    Samtec Inc.

    3,048
    RFQ

    -

    APH-1830-G-R * - Active - - - - - - - - - - - - - - -
    APH-1530-G-R

    APH-1530-G-R

    APH-1530-G-R

    Samtec Inc.

    4,773
    RFQ

    -

    APH-1530-G-R * - Active - - - - - - - - - - - - - - -
    APH-1930-G-R

    APH-1930-G-R

    APH-1930-G-R

    Samtec Inc.

    3,725
    RFQ

    -

    APH-1930-G-R * - Active - - - - - - - - - - - - - - -
    APH-0630-G-R

    APH-0630-G-R

    APH-0630-G-R

    Samtec Inc.

    2,307
    RFQ

    -

    APH-0630-G-R * - Active - - - - - - - - - - - - - - -
    APH-1230-G-R

    APH-1230-G-R

    APH-1230-G-R

    Samtec Inc.

    4,359
    RFQ

    -

    APH-1230-G-R * - Active - - - - - - - - - - - - - - -
    APH-1330-G-R

    APH-1330-G-R

    APH-1330-G-R

    Samtec Inc.

    3,873
    RFQ

    -

    APH-1330-G-R * - Active - - - - - - - - - - - - - - -
    550-10-356M26-001166

    550-10-356M26-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    4,287
    RFQ
    550-10-356M26-001166

    Datasheet

    550-10-356M26-001166 550 Bulk Active BGA 356 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    116-43-952-61-001000

    116-43-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,819
    RFQ

    -

    116-43-952-61-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-952-61-001000

    116-93-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,234
    RFQ

    -

    116-93-952-61-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-83-528-21-121111

    517-83-528-21-121111

    CONN SOCKET PGA 528POS GOLD

    Preci-Dip

    2,714
    RFQ
    517-83-528-21-121111

    Datasheet

    517-83-528-21-121111 517 Bulk Active PGA 528 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    44-3571-11

    44-3571-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    4,864
    RFQ
    44-3571-11

    Datasheet

    44-3571-11 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3575-11

    44-3575-11

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    2,181
    RFQ
    44-3575-11

    Datasheet

    44-3575-11 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 863864865866867868869870...955Next»
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