Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    144-PGM13095-11

    144-PGM13095-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,014
    RFQ
    144-PGM13095-11

    Datasheet

    144-PGM13095-11 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3552-16

    28-3552-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    2,882
    RFQ
    28-3552-16

    Datasheet

    28-3552-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APH-0532-G-R

    APH-0532-G-R

    APH-0532-G-R

    Samtec Inc.

    3,368
    RFQ

    -

    APH-0532-G-R * - Active - - - - - - - - - - - - - - -
    APH-0932-G-R

    APH-0932-G-R

    APH-0932-G-R

    Samtec Inc.

    3,192
    RFQ

    -

    APH-0932-G-R * - Active - - - - - - - - - - - - - - -
    APH-0632-G-R

    APH-0632-G-R

    APH-0632-G-R

    Samtec Inc.

    3,857
    RFQ

    -

    APH-0632-G-R * - Active - - - - - - - - - - - - - - -
    APH-0332-G-R

    APH-0332-G-R

    APH-0332-G-R

    Samtec Inc.

    4,707
    RFQ

    -

    APH-0332-G-R * - Active - - - - - - - - - - - - - - -
    APH-1732-G-R

    APH-1732-G-R

    APH-1732-G-R

    Samtec Inc.

    3,968
    RFQ

    -

    APH-1732-G-R * - Active - - - - - - - - - - - - - - -
    APH-0832-G-R

    APH-0832-G-R

    APH-0832-G-R

    Samtec Inc.

    3,718
    RFQ

    -

    APH-0832-G-R * - Active - - - - - - - - - - - - - - -
    232-1270-01-0602

    232-1270-01-0602

    CONN SOCKET PGA ZIF 32POS GOLD

    3M

    4,685
    RFQ
    232-1270-01-0602

    Datasheet

    232-1270-01-0602 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    232-1270-02-0602

    232-1270-02-0602

    CONN SOCKET PGA ZIF 32POS GOLD

    3M

    4,275
    RFQ
    232-1270-02-0602

    Datasheet

    232-1270-02-0602 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    517-83-529-21-121111

    517-83-529-21-121111

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    2,318
    RFQ
    517-83-529-21-121111

    Datasheet

    517-83-529-21-121111 517 Bulk Active PGA 529 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    232-1270-51-0602

    232-1270-51-0602

    STAGGERED ZIP STRIP POCKETS 32 C

    3M

    2,763
    RFQ

    -

    232-1270-51-0602 Textool™ - Obsolete - - - - - - - - - - - - - - -
    546-87-403-19-111147

    546-87-403-19-111147

    CONN SOCKET PGA 403POS GOLD

    Preci-Dip

    4,860
    RFQ
    546-87-403-19-111147

    Datasheet

    546-87-403-19-111147 546 Bulk Active PGA 403 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-93-223-18-095002

    510-93-223-18-095002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,016
    RFQ
    510-93-223-18-095002

    Datasheet

    510-93-223-18-095002 510 Tube Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-121-11-000002

    510-13-121-11-000002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,497
    RFQ
    510-13-121-11-000002

    Datasheet

    510-13-121-11-000002 510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-121-11-000003

    510-13-121-11-000003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,434
    RFQ
    510-13-121-11-000003

    Datasheet

    510-13-121-11-000003 510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-3572-16

    24-3572-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    3,682
    RFQ
    24-3572-16

    Datasheet

    24-3572-16 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    116-43-964-61-001000

    116-43-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,107
    RFQ

    -

    116-43-964-61-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-964-61-001000

    116-93-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,487
    RFQ

    -

    116-93-964-61-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6556-41

    28-6556-41

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,115
    RFQ
    28-6556-41

    Datasheet

    28-6556-41 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 868869870871872873874875...955Next»
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