Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    24-3570-16

    24-3570-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    2,115
    RFQ
    24-3570-16

    Datasheet

    24-3570-16 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    24-3571-16

    24-3571-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    2,229
    RFQ
    24-3571-16

    Datasheet

    24-3571-16 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    APH-1434-G-H

    APH-1434-G-H

    APH-1434-G-H

    Samtec Inc.

    2,799
    RFQ

    -

    APH-1434-G-H * - Active - - - - - - - - - - - - - - -
    APH-0534-G-H

    APH-0534-G-H

    APH-0534-G-H

    Samtec Inc.

    2,309
    RFQ

    -

    APH-0534-G-H * - Active - - - - - - - - - - - - - - -
    APH-0934-G-H

    APH-0934-G-H

    APH-0934-G-H

    Samtec Inc.

    4,146
    RFQ

    -

    APH-0934-G-H * - Active - - - - - - - - - - - - - - -
    APH-1934-G-H

    APH-1934-G-H

    APH-1934-G-H

    Samtec Inc.

    2,807
    RFQ

    -

    APH-1934-G-H * - Active - - - - - - - - - - - - - - -
    APH-1134-G-H

    APH-1134-G-H

    APH-1134-G-H

    Samtec Inc.

    2,594
    RFQ

    -

    APH-1134-G-H * - Active - - - - - - - - - - - - - - -
    APH-0634-G-H

    APH-0634-G-H

    APH-0634-G-H

    Samtec Inc.

    2,547
    RFQ

    -

    APH-0634-G-H * - Active - - - - - - - - - - - - - - -
    APH-1634-G-H

    APH-1634-G-H

    APH-1634-G-H

    Samtec Inc.

    2,953
    RFQ

    -

    APH-1634-G-H * - Active - - - - - - - - - - - - - - -
    APH-0334-G-H

    APH-0334-G-H

    APH-0334-G-H

    Samtec Inc.

    2,123
    RFQ

    -

    APH-0334-G-H * - Active - - - - - - - - - - - - - - -
    APH-1734-G-H

    APH-1734-G-H

    APH-1734-G-H

    Samtec Inc.

    2,758
    RFQ

    -

    APH-1734-G-H * - Active - - - - - - - - - - - - - - -
    APH-1334-G-H

    APH-1334-G-H

    APH-1334-G-H

    Samtec Inc.

    2,419
    RFQ

    -

    APH-1334-G-H * - Active - - - - - - - - - - - - - - -
    546-83-325-18-111147

    546-83-325-18-111147

    CONN SOCKET PGA 325POS GOLD

    Preci-Dip

    4,821
    RFQ
    546-83-325-18-111147

    Datasheet

    546-83-325-18-111147 546 Bulk Active PGA 325 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-255M16-001101

    558-10-255M16-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    2,850
    RFQ
    558-10-255M16-001101

    Datasheet

    558-10-255M16-001101 558 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-10-388M26-001166

    550-10-388M26-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,786
    RFQ
    550-10-388M26-001166

    Datasheet

    550-10-388M26-001166 550 Bulk Active BGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    32-6556-40

    32-6556-40

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,380
    RFQ
    32-6556-40

    Datasheet

    32-6556-40 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-256M20-001101

    558-10-256M20-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,540
    RFQ
    558-10-256M20-001101

    Datasheet

    558-10-256M20-001101 558 Bulk Active PGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-256M16-000101

    558-10-256M16-000101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,562
    RFQ
    558-10-256M16-000101

    Datasheet

    558-10-256M16-000101 558 Bulk Active PGA 256 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-10-272M20-001152

    550-10-272M20-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,192
    RFQ
    550-10-272M20-001152

    Datasheet

    550-10-272M20-001152 550 Bulk Active BGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-0936-G-T

    APH-0936-G-T

    APH-0936-G-T

    Samtec Inc.

    2,273
    RFQ

    -

    APH-0936-G-T * - Active - - - - - - - - - - - - - - -
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