Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    WMS-140Z

    WMS-140Z

    CONN IC DIP SOCKET 14POS GOLD

    On Shore Technology Inc.

    4,368
    RFQ
    WMS-140Z

    Datasheet

    WMS-140Z WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
    A-CCS20-Z-SM

    A-CCS20-Z-SM

    CONN SOCKET PLCC 20POS TIN

    Assmann WSW Components

    4,188
    RFQ
    A-CCS20-Z-SM

    Datasheet

    A-CCS20-Z-SM - Bag Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    03-0518-10

    03-0518-10

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,837
    RFQ
    03-0518-10

    Datasheet

    03-0518-10 518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    01-0513-11H

    01-0513-11H

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    2,619
    RFQ
    01-0513-11H

    Datasheet

    01-0513-11H 0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0518-00

    03-0518-00

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,585
    RFQ
    03-0518-00

    Datasheet

    03-0518-00 518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0518-11

    02-0518-11

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,067
    RFQ
    02-0518-11

    Datasheet

    02-0518-11 518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-1518-11

    02-1518-11

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    2,582
    RFQ
    02-1518-11

    Datasheet

    02-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP1X10-011B

    SIP1X10-011B

    SIP1X10-011B-SIP SOCKET 10 CTS

    Amphenol ICC (FCI)

    4,708
    RFQ
    SIP1X10-011B

    Datasheet

    SIP1X10-011B SIP1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X08-001B

    SIP1X08-001B

    SIP1X08-001B-SIP SOCKET 8 CTS

    Amphenol ICC (FCI)

    4,796
    RFQ
    SIP1X08-001B

    Datasheet

    SIP1X08-001B SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    HLS-0101-T-31

    HLS-0101-T-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,855
    RFQ
    HLS-0101-T-31

    Datasheet

    HLS-0101-T-31 HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-83-304-41-001101

    614-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,888
    RFQ
    614-83-304-41-001101

    Datasheet

    614-83-304-41-001101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-308-41-605101

    110-87-308-41-605101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,876
    RFQ
    110-87-308-41-605101

    Datasheet

    110-87-308-41-605101 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4824-3004-CP

    4824-3004-CP

    CONN IC DIP SOCKET 24POS TIN

    3M

    4,714
    RFQ
    4824-3004-CP

    Datasheet

    4824-3004-CP 4800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    241-08-1-03

    241-08-1-03

    CONN IC DIP SOCKET 8POS TIN

    CNC Tech

    3,945
    RFQ
    241-08-1-03

    Datasheet

    241-08-1-03 - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    02-0513-10T

    02-0513-10T

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,583
    RFQ
    02-0513-10T

    Datasheet

    02-0513-10T 0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    DIP314-011B

    DIP314-011B

    DIP SOCKET 14 CTS

    Amphenol ICC (FCI)

    4,077
    RFQ
    DIP314-011B

    Datasheet

    DIP314-011B - Bag Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    A20-LCG

    A20-LCG

    CONN IC DIP SOCKET 20POS GOLD

    Assmann WSW Components

    4,637
    RFQ

    -

    A20-LCG - - Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    110-83-304-41-105101

    110-83-304-41-105101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,957
    RFQ
    110-83-304-41-105101

    Datasheet

    110-83-304-41-105101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-304-41-007101

    116-87-304-41-007101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,870
    RFQ
    116-87-304-41-007101

    Datasheet

    116-87-304-41-007101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AW 127-19/Z-T

    AW 127-19/Z-T

    SOCKET 19 CONTACTS SINGLE ROW

    Assmann WSW Components

    4,483
    RFQ
    AW 127-19/Z-T

    Datasheet

    AW 127-19/Z-T - - Active - - - - - - - - - - - - - - -
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