Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    03-0518-10H

    03-0518-10H

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,722
    RFQ
    03-0518-10H

    Datasheet

    03-0518-10H 518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-308-41-003101

    115-87-308-41-003101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,188
    RFQ
    115-87-308-41-003101

    Datasheet

    115-87-308-41-003101 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X06-157B

    SIP050-1X06-157B

    1X06-157B-SIP SOCKET 6 CTS

    Amphenol ICC (FCI)

    3,770
    RFQ
    SIP050-1X06-157B

    Datasheet

    SIP050-1X06-157B SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    110-87-310-41-005101

    110-87-310-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,290
    RFQ
    110-87-310-41-005101

    Datasheet

    110-87-310-41-005101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-012-05-001101

    510-87-012-05-001101

    CONN SOCKET PGA 12POS GOLD

    Preci-Dip

    2,139
    RFQ
    510-87-012-05-001101

    Datasheet

    510-87-012-05-001101 510 Bulk Active PGA 12 (5 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-304-31-012101

    614-83-304-31-012101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,823
    RFQ
    614-83-304-31-012101

    Datasheet

    614-83-304-31-012101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    245-22-1-03

    245-22-1-03

    CONN IC DIP SOCKET 22POS TIN

    CNC Tech

    3,703
    RFQ
    245-22-1-03

    Datasheet

    245-22-1-03 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    SIP050-1X05-160B

    SIP050-1X05-160B

    1X05-160B-SIP SOCKET 5 CTS

    Amphenol ICC (FCI)

    2,044
    RFQ
    SIP050-1X05-160B

    Datasheet

    SIP050-1X05-160B SIP050-1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    115-87-308-41-001101

    115-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,109
    RFQ

    -

    115-87-308-41-001101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    940-99-032-17-400000

    940-99-032-17-400000

    CONN SOCKET PLCC 32POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    4,415
    RFQ
    940-99-032-17-400000

    Datasheet

    940-99-032-17-400000 940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-83-306-41-001101

    110-83-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,748
    RFQ
    110-83-306-41-001101

    Datasheet

    110-83-306-41-001101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-312-41-001101

    110-87-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    2,499
    RFQ
    110-87-312-41-001101

    Datasheet

    110-87-312-41-001101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS32-Z

    A-CCS32-Z

    CONN SOCKET PLCC 32POS TIN

    Assmann WSW Components

    2,246
    RFQ
    A-CCS32-Z

    Datasheet

    A-CCS32-Z - Bag Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    DIP316-011B

    DIP316-011B

    DIP SOCKET 16 CTS

    Amphenol ICC (FCI)

    4,732
    RFQ
    DIP316-011B

    Datasheet

    DIP316-011B - Bag Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    A08-LCG-T-R

    A08-LCG-T-R

    CONN IC DIP SOCKET 8POS GOLD

    Assmann WSW Components

    2,926
    RFQ
    A08-LCG-T-R

    Datasheet

    A08-LCG-T-R - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A-CCS28-Z

    A-CCS28-Z

    CONN SOCKET PLCC 28POS TIN

    Assmann WSW Components

    4,429
    RFQ
    A-CCS28-Z

    Datasheet

    A-CCS28-Z - Bag Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    AW 127-22/Z-T

    AW 127-22/Z-T

    SOCKET 22 CONTACTS SINGLE ROW

    Assmann WSW Components

    2,372
    RFQ
    AW 127-22/Z-T

    Datasheet

    AW 127-22/Z-T - - Active - - - - - - - - - - - - - - -
    A 22-LC-TT

    A 22-LC-TT

    IC-SOCKETS

    Assmann WSW Components

    2,569
    RFQ

    -

    A 22-LC-TT - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    146-87-304-41-035101

    146-87-304-41-035101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,729
    RFQ
    146-87-304-41-035101

    Datasheet

    146-87-304-41-035101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X02-041B

    SIP1X02-041B

    SIP1X02-041B-SIP SOCKET 2 CTS

    Amphenol ICC (FCI)

    2,938
    RFQ
    SIP1X02-041B

    Datasheet

    SIP1X02-041B SIP1x Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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