Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    7100148803

    7100148803

    TEXTOOL1012-0-0289-0B-00L20 0.65

    3M

    3,250
    RFQ

    -

    7100148803 - Bulk Active - - - - - - - - - - - - - - -
    192-PRS17027-12

    192-PRS17027-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,403
    RFQ
    192-PRS17027-12

    Datasheet

    192-PRS17027-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7010402522

    7010402522

    TEXTOOLTEST & BURN-IN SOCKETS PL

    3M

    4,265
    RFQ

    -

    7010402522 - Bulk Active - - - - - - - - - - - - - - -
    244-5205-00

    244-5205-00

    3M TEXTOOL OPEN-TOP SOCKETS FOR

    3M

    3,118
    RFQ

    -

    244-5205-00 Textool™ Box Active - - - - - - - - - - - - - - -
    216-PRS21016-12

    216-PRS21016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,795
    RFQ
    216-PRS21016-12

    Datasheet

    216-PRS21016-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    208-PLS17017-12

    208-PLS17017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,620
    RFQ
    208-PLS17017-12

    Datasheet

    208-PLS17017-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    32-3574-18

    32-3574-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,715
    RFQ
    32-3574-18

    Datasheet

    32-3574-18 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    32-6574-18

    32-6574-18

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,717
    RFQ
    32-6574-18

    Datasheet

    32-6574-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    209-PRS17030-12

    209-PRS17030-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,439
    RFQ
    209-PRS17030-12

    Datasheet

    209-PRS17030-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    209-PRS17046-12

    209-PRS17046-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,041
    RFQ
    209-PRS17046-12

    Datasheet

    209-PRS17046-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    176-PRS15014-12

    176-PRS15014-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,892
    RFQ
    176-PRS15014-12

    Datasheet

    176-PRS15014-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    280-PLS19006-12

    280-PLS19006-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,338
    RFQ
    280-PLS19006-12

    Datasheet

    280-PLS19006-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    280-PRS19006-12

    280-PRS19006-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,012
    RFQ
    280-PRS19006-12

    Datasheet

    280-PRS19006-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PRS19012-12

    281-PRS19012-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,044
    RFQ
    281-PRS19012-12

    Datasheet

    281-PRS19012-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    179-PLS18038-12

    179-PLS18038-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,186
    RFQ
    179-PLS18038-12

    Datasheet

    179-PLS18038-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    179-PRS18038-12

    179-PRS18038-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,799
    RFQ
    179-PRS18038-12

    Datasheet

    179-PRS18038-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PRS18037-12

    281-PRS18037-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,437
    RFQ
    281-PRS18037-12

    Datasheet

    281-PRS18037-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    32-3575-18

    32-3575-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,789
    RFQ
    32-3575-18

    Datasheet

    32-3575-18 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    32-6575-18

    32-6575-18

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,631
    RFQ
    32-6575-18

    Datasheet

    32-6575-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    180-PLS18007-12

    180-PLS18007-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,789
    RFQ
    180-PLS18007-12

    Datasheet

    180-PLS18007-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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