Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-3551-18

    32-3551-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,433
    RFQ

    -

    32-3551-18 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    32-3552-18

    32-3552-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    2,916
    RFQ

    -

    32-3552-18 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    32-3553-18

    32-3553-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    2,281
    RFQ

    -

    32-3553-18 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    32-6552-18

    32-6552-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,653
    RFQ

    -

    32-6552-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    32-6553-18

    32-6553-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    3,426
    RFQ

    -

    32-6553-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3554-18

    32-3554-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    4,168
    RFQ

    -

    32-3554-18 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    32-6554-18

    32-6554-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    2,563
    RFQ

    -

    32-6554-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    48-6571-18

    48-6571-18

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    4,308
    RFQ
    48-6571-18

    Datasheet

    48-6571-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    7100265143

    7100265143

    3MTEXTOOTEST & BURN-IN BALL GRID

    3M

    2,853
    RFQ

    -

    7100265143 - Bulk Active - - - - - - - - - - - - - - -
    42-6551-18

    42-6551-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    2,341
    RFQ

    -

    42-6551-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    42-6553-18

    42-6553-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    4,144
    RFQ

    -

    42-6553-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    42-3554-18

    42-3554-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    2,699
    RFQ

    -

    42-3554-18 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    42-6554-18

    42-6554-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    2,061
    RFQ

    -

    42-6554-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    223-PLS18017-12

    223-PLS18017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,208
    RFQ
    223-PLS18017-12

    Datasheet

    223-PLS18017-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    223-PLS18039-12

    223-PLS18039-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,855
    RFQ
    223-PLS18039-12

    Datasheet

    223-PLS18039-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    223-PRS18017-12

    223-PRS18017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,656
    RFQ
    223-PRS18017-12

    Datasheet

    223-PRS18017-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    223-PRS18039-12

    223-PRS18039-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,711
    RFQ
    223-PRS18039-12

    Datasheet

    223-PRS18039-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    2256-9308-01-2401

    2256-9308-01-2401

    3M TEXTOOL 2256-9308-01-2401 PP1

    3M

    4,592
    RFQ

    -

    2256-9308-01-2401 Textool™ Bulk Obsolete - - - - - - - - - - - - - - -
    225-PRS17007-12

    225-PRS17007-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,825
    RFQ
    225-PRS17007-12

    Datasheet

    225-PRS17007-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    225-PRS18003-12

    225-PRS18003-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,347
    RFQ
    225-PRS18003-12

    Datasheet

    225-PRS18003-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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