Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    AR 16 HGL-TT

    AR 16 HGL-TT

    SOCKET

    Assmann WSW Components

    4,358
    RFQ
    AR 16 HGL-TT

    Datasheet

    AR 16 HGL-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    940-99-068-24-000000

    940-99-068-24-000000

    CONN SOCKET PLCC 68POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,406
    RFQ
    940-99-068-24-000000

    Datasheet

    940-99-068-24-000000 940 Tube Obsolete PLCC 68 (4 x 17) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-87-308-41-001101

    612-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,951
    RFQ
    612-87-308-41-001101

    Datasheet

    612-87-308-41-001101 612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP316-014B

    DIP316-014B

    DIP SOCKET 16 CTS

    Amphenol ICC (FCI)

    2,541
    RFQ
    DIP316-014B

    Datasheet

    DIP316-014B - Bag Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    115-87-310-41-001101

    115-87-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,848
    RFQ

    -

    115-87-310-41-001101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 36-HZL-TT

    AR 36-HZL-TT

    SOCKET

    Assmann WSW Components

    2,620
    RFQ

    -

    AR 36-HZL-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A-CCS52-Z-SM

    A-CCS52-Z-SM

    CONN SOCKET PLCC 52POS TIN

    Assmann WSW Components

    2,552
    RFQ
    A-CCS52-Z-SM

    Datasheet

    A-CCS52-Z-SM - Bag Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    940-99-028-17-400000

    940-99-028-17-400000

    CONN SOCKET PLCC 28POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,902
    RFQ
    940-99-028-17-400000

    Datasheet

    940-99-028-17-400000 940 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    A14-LCG-T-R

    A14-LCG-T-R

    CONN IC DIP SOCKET 14POS GOLD

    Assmann WSW Components

    4,853
    RFQ
    A14-LCG-T-R

    Datasheet

    A14-LCG-T-R - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    DIP320-011B

    DIP320-011B

    DIP320-011B-DIP SOCKET 20 CTS

    Amphenol ICC (FCI)

    4,563
    RFQ
    DIP320-011B

    Datasheet

    DIP320-011B - Bag Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    540-88-032-17-400-2

    540-88-032-17-400-2

    CONN SOCKET PLCC 32POS TIN

    Preci-Dip

    3,257
    RFQ
    540-88-032-17-400-2

    Datasheet

    540-88-032-17-400-2 540 Bulk Obsolete PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    AW 127-25/Z-T

    AW 127-25/Z-T

    SOCKET 25 CONTACTS SINGLE ROW

    Assmann WSW Components

    3,592
    RFQ
    AW 127-25/Z-T

    Datasheet

    AW 127-25/Z-T - - Active - - - - - - - - - - - - - - -
    822475-2

    822475-2

    CONN SOCKET PLCC 32POS TIN

    TE Connectivity AMP Connectors

    3,190
    RFQ
    822475-2

    Datasheet

    822475-2 - Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -
    4842-6004-CP

    4842-6004-CP

    CONN IC DIP SOCKET 42POS TIN

    3M

    3,175
    RFQ

    -

    4842-6004-CP 4800 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    AR24-HZL-TT

    AR24-HZL-TT

    CONN IC DIP SOCKET 24POS TIN

    Assmann WSW Components

    4,303
    RFQ
    AR24-HZL-TT

    Datasheet

    AR24-HZL-TT - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    04-1518-00

    04-1518-00

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    3,991
    RFQ
    04-1518-00

    Datasheet

    04-1518-00 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0518-11H

    02-0518-11H

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,046
    RFQ
    02-0518-11H

    Datasheet

    02-0518-11H 518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-1518-11H

    02-1518-11H

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    2,257
    RFQ
    02-1518-11H

    Datasheet

    02-1518-11H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    146-83-304-41-035101

    146-83-304-41-035101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,144
    RFQ
    146-83-304-41-035101

    Datasheet

    146-83-304-41-035101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-304-41-036101

    146-83-304-41-036101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,952
    RFQ
    146-83-304-41-036101

    Datasheet

    146-83-304-41-036101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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