Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    917-87-103-41-053101

    917-87-103-41-053101

    CONN TRANSIST TO-5 3POS GOLD

    Preci-Dip

    2,726
    RFQ
    917-87-103-41-053101

    Datasheet

    917-87-103-41-053101 917 Bulk Active Transistor, TO-5 3 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-210-41-117101

    114-87-210-41-117101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,403
    RFQ
    114-87-210-41-117101

    Datasheet

    114-87-210-41-117101 114 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X15-014B

    SIP1X15-014B

    SIP1X15-014B-SIP SOCKET 15 CTS

    Amphenol ICC (FCI)

    3,839
    RFQ
    SIP1X15-014B

    Datasheet

    SIP1X15-014B SIP1x Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X08-014B

    SIP1X08-014B

    SIP1X08-014B-SIP SOCKET 8 CTS

    Amphenol ICC (FCI)

    3,985
    RFQ
    SIP1X08-014B

    Datasheet

    SIP1X08-014B SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    612-83-306-41-001101

    612-83-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,411
    RFQ
    612-83-306-41-001101

    Datasheet

    612-83-306-41-001101 612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-306-41-012101

    116-87-306-41-012101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,097
    RFQ
    116-87-306-41-012101

    Datasheet

    116-87-306-41-012101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-308-41-001101

    110-83-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,250
    RFQ
    110-83-308-41-001101

    Datasheet

    110-83-308-41-001101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X07-160B

    SIP050-1X07-160B

    1X07-160B-SIP SOCKET 7 CTS

    Amphenol ICC (FCI)

    4,960
    RFQ
    SIP050-1X07-160B

    Datasheet

    SIP050-1X07-160B SIP050-1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    BU060Z-178-HT

    BU060Z-178-HT

    CONN IC DIP SOCKET 6POS GOLD

    On Shore Technology Inc.

    4,054
    RFQ
    BU060Z-178-HT

    Datasheet

    BU060Z-178-HT BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    130-024-000

    130-024-000

    CONN IC DIP SOCKET 24POS GOLD

    3M

    3,387
    RFQ

    -

    130-024-000 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    04-0518-00

    04-0518-00

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    2,773
    RFQ
    04-0518-00

    Datasheet

    04-0518-00 518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0518-11

    04-0518-11

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    4,702
    RFQ
    04-0518-11

    Datasheet

    04-0518-11 518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-1518-11

    04-1518-11

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    4,192
    RFQ
    04-1518-11

    Datasheet

    04-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    05-0518-10T

    05-0518-10T

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    4,855
    RFQ
    05-0518-10T

    Datasheet

    05-0518-10T 518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-312-41-001101

    115-87-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,700
    RFQ

    -

    115-87-312-41-001101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-310-41-003101

    115-87-310-41-003101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,933
    RFQ
    115-87-310-41-003101

    Datasheet

    115-87-310-41-003101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-304-41-002101

    116-83-304-41-002101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,570
    RFQ
    116-83-304-41-002101

    Datasheet

    116-83-304-41-002101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-308-41-018101

    116-87-308-41-018101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,046
    RFQ
    116-87-308-41-018101

    Datasheet

    116-87-308-41-018101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-306-41-007101

    116-87-306-41-007101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,521
    RFQ
    116-87-306-41-007101

    Datasheet

    116-87-306-41-007101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    04-0518-10T

    04-0518-10T

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,467
    RFQ
    04-0518-10T

    Datasheet

    04-0518-10T 518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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