Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
630-25AB HEATSINK FOR 35MM BGA Wakefield-Vette	3,705	-	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.250" (6.35mm)	-	7.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
826002B05300 HEATSINK STAMP 9.7X44.5X36.8MM Comair Rotron	3,223	-	RFQ	Datasheet	-	Bulk	Obsolete	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.380" (9.65mm)	3.0W @ 30°C	4.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
411615B02500 HEATSINK EXTRUDED 25X41.6X38.1MM Comair Rotron	2,997	-	RFQ	Datasheet	-	Bulk	Obsolete	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	10.0W @ 50°C	1.50°C/W @ 700 LFM	-	Aluminum	Black Anodized
HSE-B381-045H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	3,319	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.500" (38.10mm)	1.772" (45.00mm)	-	0.500" (12.70mm)	9.9W @ 75°C	2.63°C/W @ 200 LFM	7.58°C/W	Aluminum Alloy	Black Anodized
V5220Y PROFILE HEATSINK Assmann WSW Components	2,602	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.260" (32.00mm)	-	0.787" (20.00mm)	2.0W @ 24°C	3.20°C/W @ 300 LFM	7.00°C/W	Aluminum Alloy	Black Anodized
7025BG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,053	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.130" (28.70mm)	1.900" (48.26mm)	-	0.950" (24.13mm)	6.0W @ 50°C	4.00°C/W @ 300 LFM	6.80°C/W	Aluminum	Black Anodized
412320B02500 HEATSINK EXTRUDED 16X16.5X50.8MM Comair Rotron	4,461	-	RFQ	Datasheet	-	Bulk	Obsolete	Board Level, Vertical	TO-220, TO-218	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	0.650" (16.51mm)	-	0.630" (16.00mm)	1.5W @ 20°C	2.00°C/W @ 800 LFM	-	Aluminum	Black Anodized
V2136N1 HEATSINK CPU STAMPED Assmann WSW Components	2,145	-	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.394" (10.00mm)	-	-	-	Aluminum Alloy	Natural Anodized
642-35AB HEATSINK FOR 35MM BGA Wakefield-Vette	4,342	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.350" (8.89mm)	-	8.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
V2000Y PROFILE HEATSINK Assmann WSW Components	4,274	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.378" (35.00mm)	-	1.000" (25.40mm)	-	-	4.00°C/W	Aluminum	Black Anodized
593202B03400G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,347	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.380" (35.05mm)	-	0.480" (12.19mm)	6.0W @ 60°C	5.00°C/W @ 200 LFM	10.40°C/W	Aluminum	Black Anodized
V2200N1-F HEATSINK CPU W/ADHESIVE STAMPED Assmann WSW Components	4,912	-	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.512" (13.00mm)	-	-	-	Aluminum Alloy	Natural Anodized
TV3G TV3G Boyd Laconia, LLC	3,522	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
XL25-50-50-5 CERAMIC HEAT SPREADER 50X50MM GR t-Global Technology	10	-	RFQ	Datasheet	XL-25	Tray	Obsolete	Heat Spreader	Assorted (BGA, LGA, CPU, ASIC...)	-	Square	1.969" (50.00mm)	1.969" (50.00mm)	-	0.197" (5.00mm)	-	-	-	Ceramic	-
PRT-00121 HEATSINK TO-220 SparkFun Electronics	3,870	-	RFQ	-	-	Bulk	Active	Top Mount	TO-220	Bolt On	-	-	-	-	-	-	-	-	-	Black Anodized
V8511XE1 PROFILE HEATSINK Assmann WSW Components	3,784	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	-	-	5.00°C/W	Aluminum Alloy	Black Anodized
V2201N1 HEATSINK CPU STAMPED Assmann WSW Components	2,313	-	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.457" (37.00mm)	1.457" (37.00mm)	-	0.551" (14.00mm)	-	-	-	Aluminum Alloy	Natural Anodized
V9733E1-LP PROFILE HEATSINK Assmann WSW Components	4,211	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.654" (42.00mm)	-	0.984" (25.00mm)	4.0W @ 40°C	1.50°C/W @ 600 LFM	11.00°C/W	Aluminum Alloy	Black Anodized
532602B00000 BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,118	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	6.0W @ 40°C	2.00°C/W @ 400 LFM	5.50°C/W	Aluminum	Black Anodized
374024B00032G 374024B00032G Boyd Laconia, LLC	3,955	-	RFQ	-	-	Bulk	Active	Top Mount	-	-	Square, Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	0.5W @ 20°C	8.00°C/W @ 450 LFM	40.00°C/W	Aluminum	Black Anodized

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