Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSE-B18381-035H-02 HEAT SINK, EXTRUSION, TO-218, 38 Same Sky (Formerly CUI Devices)	2,395	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Clip and PC Pin	Rectangular, Angled Fins	1.500" (38.10mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	12.0W @ 75°C	3.79°C/W @ 200 LFM	6.25°C/W	Aluminum Alloy	Black Anodized
566010B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,202	-	RFQ	Datasheet	-	Bulk	Active	Board Level	Multiwatt, SIP	Clip	Rectangular, Fins	1.220" (30.99mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	3.0W @ 40°C	4.00°C/W @ 300 LFM	11.50°C/W	Aluminum	Black Anodized
624-25ABT1E HEATSINK FOR 21MM BGA Wakefield-Vette	2,828	-	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.250" (6.35mm)	-	25.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSE-B18317-035H-01 HEAT SINK, EXTRUSION, TO-218, 31 Same Sky (Formerly CUI Devices)	2,534	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Clip and PC Pin	Rectangular, Angled Fins	1.250" (31.75mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	10.0W @ 75°C	4.33°C/W @ 200 LFM	7.50°C/W	Aluminum Alloy	Black Anodized
V7477Z4 PROFILE HEATSINK Assmann WSW Components	2,184	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	2.500" (63.50mm)	1.378" (35.00mm)	-	0.500" (12.70mm)	-	-	7.00°C/W	Aluminum Alloy	Black Anodized
KU-SMK-0495-ES-ST-0,6MM-SG KU-SMK-0495-ES-ST-0,6MM-SG Boyd Laconia, LLC	4,318	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
374024B60023G 374024B60023G Boyd Laconia, LLC	4,041	-	RFQ	-	-	Bulk	Active	Top Mount	BGA	Solder Anchor	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	-	11.69°C/W @ 200 LFM	40.00°C/W	Aluminum	Black Anodized
374824B00000G 374824B00000G Boyd Laconia, LLC	2,249	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
HSE-B18317-035H HEAT SINK, EXTRUSION, TO-218, 31 Same Sky (Formerly CUI Devices)	3,121	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Angled Fins	1.250" (31.75mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	9.8W @ 75°C	3.63°C/W @ 200 LFM	7.65°C/W	Aluminum Alloy	Black Anodized
V2136N1-F-LP HEATSINK CPU W/ADHESIVE STAMPED Assmann WSW Components	3,856	-	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.394" (10.00mm)	-	-	-	Aluminum Alloy	Natural Anodized
630-60AB HEATSINK FOR BGA 35MM Wakefield-Vette	4,920	-	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.598" (15.20mm)	-	3.00°C/W @ 350 LFM	-	Aluminum	Black Anodized
530001B02100G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,036	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Fins	2.500" (63.50mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	20.0W @ 60°C	1.00°C/W @ 800 LFM	8.00°C/W	Aluminum	Black Anodized
V8511ZE1 PROFILE HEATSINK Assmann WSW Components	2,414	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	2.500" (63.50mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	-	-	4.10°C/W	Aluminum Alloy	Black Anodized
624-25ABT3 HEATSINK FOR 21MM BGA Wakefield-Vette	3,963	-	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.250" (6.35mm)	-	25.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
V9733E2-LP PROFILE HEATSINK Assmann WSW Components	4,574	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.654" (42.00mm)	-	0.984" (25.00mm)	4.0W @ 30°C	2.00°C/W @ 400 LFM	5.50°C/W	Aluminum Alloy	Black Anodized
627-10ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	2,983	-	RFQ	Datasheet	627	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	1.000" (25.40mm)	6.0W @ 76°C	5.80°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSE-B18381-060H-W HEAT SINK, EXTRUSION, TO-218, 38 Same Sky (Formerly CUI Devices)	2,191	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Angled Fins	1.500" (38.10mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	12.0W @ 75°C	3.52°C/W @ 200 LFM	6.25°C/W	Aluminum Alloy	Black Anodized
677-10ABP HEATSINK MULTIWATT 1.0" BLK Wakefield-Vette	3,003	-	RFQ	Datasheet	677	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247, Multiwatt	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	6.0W @ 52°C	3.10°C/W @ 200 LFM	8.70°C/W	Aluminum	Black Anodized
667-10ABSP HEATSINK TO-220 W/S/O PINS BLK Wakefield-Vette	3,443	-	RFQ	Datasheet	667	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	1.000" (25.40mm)	6.0W @ 76°C	5.80°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSE-B18254-060H-W HEAT SINK, EXTRUSION, TO-218, 25 Same Sky (Formerly CUI Devices)	3,206	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Angled Fins	1.000" (25.40mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	8.1W @ 75°C	3.09°C/W @ 200 LFM	9.26°C/W	Aluminum Alloy	Black Anodized

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