Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
OMNI-UNI-27-50 HEATSINK TO-247 TO-264 TO-220 Wakefield-Vette	3,972	-	RFQ	Datasheet	OmniKlip™	Bulk	Active	Board Level, Vertical	TO-220, TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	1.969" (50.00mm)	1.063" (27.00mm)	-	1.969" (50.00mm)	-	-	-	Aluminum	Black Anodized
528-45AB-T725 HEATSINK DC/DC HALF BRICK VERT Wakefield-Vette	3,608	-	RFQ	Datasheet	528	Bulk	Active	Board Level, Vertical	Half Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	2.400" (60.96mm)	2.280" (57.91mm)	-	0.450" (11.43mm)	7.0W @ 60°C	2.10°C/W @ 300 LFM	-	Aluminum	Black Anodized
662-15AG HEATSINK EXTRUSION 45MM Wakefield-Vette	4,122	-	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Gold Iridite
601K HEATSINK FOR TO66 Wakefield-Vette	4,786	-	RFQ	Datasheet	601	Bulk	Active	Board Level	TO-66	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	2.000" (50.80mm)	1.250" (31.75mm)	-	0.562" (14.28mm)	5.0W @ 50°C	5.85°C/W @ 100 LFM	-	Aluminum	Black Anodized
7140DG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,566	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Clip and PC Pin	Rectangular, Fins	0.700" (17.78mm)	0.900" (22.86mm)	-	0.375" (9.52mm)	1.5W @ 50°C	10.00°C/W @ 200 LFM	20.80°C/W	Copper	Tin
660-29ABT4E HEATSINK EXTRUSION 37MM Wakefield-Vette	4,473	-	RFQ	Datasheet	660	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.530" (38.86mm)	1.530" (38.86mm)	-	0.285" (7.24mm)	2.0W @ 30°C	7.00°C/W @ 100 LFM	-	Aluminum	Black Anodized
ATS-P1-165-C2-R0 HEATSINK 25X25X10MM R-TAB T766 Advanced Thermal Solutions Inc.	3,666	-	RFQ	Datasheet	pushPIN™	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	-	18.36°C/W @ 100 LFM	-	Aluminum	Blue Anodized
DA-T268-401E-TR TO-268 SMD HEAT SINK ANODZD Ohmite	2,910	-	RFQ	Datasheet	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	-	0.460" (11.68mm)	9.0W @ 43°C	5°C/W @ 500 LFM	-	Aluminum	Black Anodized
547-95AB HEATSINK DC/DC QUARTER BRICK Wakefield-Vette	4,553	-	RFQ	Datasheet	547	Bulk	Active	Board Level, Vertical	Quarter Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	1.450" (36.83mm)	2.280" (57.91mm)	-	0.950" (24.13mm)	-	2.20°C/W @ 300 LFM	-	Aluminum	Black Anodized
662-15ABT3 HEATSINK EXTRUSION 45MM Wakefield-Vette	3,036	-	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
326005R00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,521	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-5	Press Fit	Cylindrical	-	-	0.318" (8.07mm) ID, 0.500" (12.70mm) OD	0.375" (9.52mm)	1.8W @ 90°C	30.00°C/W @ 200 LFM	57.00°C/W	Aluminum	Red Anodized
659-65ABT4E HEATSINK EXTRUSION 37MM Wakefield-Vette	4,493	-	RFQ	Datasheet	659	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.450" (36.83mm)	1.450" (36.83mm)	-	0.650" (16.51mm)	2.0W @ 20°C	1.50°C/W @ 600 LFM	-	Aluminum	Black Anodized
591202B03100G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,904	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.600" (15.24mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 40°C	16.00°C/W @ 200 LFM	26.80°C/W	Aluminum	Black Anodized
660-29ABT5 HEATSINK EXTRUSION 37MM Wakefield-Vette	4,042	-	RFQ	Datasheet	660	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.530" (38.86mm)	1.530" (38.86mm)	-	0.285" (7.24mm)	2.0W @ 30°C	7.00°C/W @ 100 LFM	-	Aluminum	Black Anodized
501906B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,497	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-66	Bolt On	Rhombus	1.550" (39.37mm)	1.040" (26.42mm)	-	1.000" (25.40mm)	4.0W @ 40°C	4.00°C/W @ 300 LFM	8.00°C/W	Aluminum	Black Anodized
374124B00032G BGA,374124B00032G Boyd Laconia, LLC	3,360	-	RFQ	-	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.709" (18.00mm)	-	7.39°C/W @ 200 LFM	23.40°C/W	Aluminum	Black Anodized
662-15AGT3 HEATSINK EXTRUSION 45MM Wakefield-Vette	4,309	-	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Gold Iridite
662-15AGT5 HEATSINK EXTRUSION 45MM Wakefield-Vette	3,468	-	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Gold Iridite
BDN17-3CB/A01 HEATSINK CPU W/ADHESIVE 1.71"SQ CTS Thermal Management Products	2,411	-	RFQ	Datasheet	BDN	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.710" (43.43mm)	1.710" (43.43mm)	-	0.355" (9.02mm)	-	3.80°C/W @ 400 LFM	11.50°C/W	Aluminum	Black Anodized
0372505020 CHIPSET COOLER #2 COPPER 6500RPM Molex	2,648	-	RFQ	-	-	Bulk	Obsolete	-	-	-	-	-	-	-	-	-	-	-	-	-

Total 122183 Record«Prev 1... 2229 2230 2231 223222332234 2235 2236...6110 Next»

HOME

PRODUCT

PHONE

USER

[email protected]