Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
576203B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,947	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-3	Bolt On	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	0.750" (19.05mm)	4.0W @ 30°C	2.50°C/W @ 400 LFM	6.20°C/W	Aluminum	Black Anodized
655-53ABT1E HEATSINK FOR 40MM BGA Wakefield-Vette	3,132	-	RFQ	Datasheet	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.525" (13.34mm)	4.0W @ 40°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
655-53ABT4E HEATSINK FOR 40MM BGA Wakefield-Vette	4,817	-	RFQ	Datasheet	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.525" (13.34mm)	4.0W @ 40°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
655-53ABT6 HEATSINK FOR 40MM BGA Wakefield-Vette	3,690	-	RFQ	Datasheet	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.525" (13.34mm)	4.0W @ 40°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
MBH31001-10LF/2.0 AL HEAT SINK 31X31X10MM Malico Inc.	2,001	-	RFQ	-	-		Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.205" (30.61mm)	1.205" (30.61mm)	-	0.394" (10.00mm)	-	-	-	Aluminum	Black Anodized
OMNI-UNI-30-25-D HEATSINK TO-247 TO-264 TO-220 Wakefield-Vette	2,932	-	RFQ	Datasheet	OmniKlip™	Bulk	Active	Board Level, Vertical	TO-220, TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	0.984" (25.00mm)	1.181" (30.00mm)	-	2.362" (60.00mm)	-	-	-	Aluminum	Black Anodized
628-20ABT1E HEATSINK FOR 45MM BGA Wakefield-Vette	3,655	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.200" (5.08mm)	4.0W @ 80°C	8.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
V2035A CPU HEATSINKS Assmann WSW Components	4,481	-	RFQ	-	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.230" (31.25mm)	1.230" (31.25mm)	-	0.728" (18.50mm)	-	-	4.50°C/W	Aluminum Alloy	Clean Finished
642-60ABT3 HEATSINK FOR 35MM BGA Wakefield-Vette	3,440	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.600" (15.24mm)	-	6.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
527-24AB-ME HEATSINK DC/DC HALF BRICK VERT Wakefield-Vette	4,757	-	RFQ	Datasheet	527	Bulk	Active	Board Level	Half Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	2.280" (57.91mm)	2.400" (60.96mm)	-	0.950" (24.13mm)	5.0W @ 60°C	4.20°C/W @ 300 LFM	-	Aluminum	Black Anodized
527-24AB-MET725 HEATSINK DC/DC HALF BRICK VERT Wakefield-Vette	2,468	-	RFQ	Datasheet	527	Bulk	Active	Board Level	Half Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	2.280" (57.91mm)	2.400" (60.96mm)	-	0.950" (24.13mm)	5.0W @ 60°C	4.20°C/W @ 300 LFM	-	Aluminum	Black Anodized
527-24AB-T725 HEATSINK DC/DC HALF BRICK VERT Wakefield-Vette	2,065	-	RFQ	Datasheet	527	Bulk	Active	Board Level	Half Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	2.280" (57.91mm)	2.400" (60.96mm)	-	0.950" (24.13mm)	5.0W @ 60°C	4.20°C/W @ 300 LFM	-	Aluminum	Black Anodized
657-20ABPESC HEATSINK TO-220 W/PINS BLK 2" Wakefield-Vette	3,919	-	RFQ	Datasheet	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	2.000" (50.80mm)	6.0W @ 32°C	2.90°C/W @ 200 LFM	-	Aluminum	Black Anodized
EV-T220-38E HEATSINK FOR TO-220 Ohmite	2	-	RFQ	Datasheet	E	Box	Obsolete	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.378" (35.00mm)	-	0.500" (12.70mm)	8.0W @ 80°C	4.00°C/W @ 300 LFM	13.00°C/W	Aluminum	Degreased
6084BG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,403	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.330" (8.38mm)	1.0W @ 30°C	7.00°C/W @ 300 LFM	22.50°C/W	Aluminum	Black Anodized
530510B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,256	-	RFQ	Datasheet	-	Bulk	Active	Board Level	Multiwatt, SIP	Clip	Rectangular, Fins	0.620" (15.75mm)	0.845" (21.46mm)	-	0.380" (9.65mm)	2.0W @ 50°C	6.00°C/W @ 400 LFM	20.60°C/W	Aluminum	Black Anodized
375424B60023G 375424B60023G Boyd Laconia, LLC	3,075	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
625-60ABT4E HEATSINK FOR 25MM BGA Wakefield-Vette	3,604	-	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.600" (15.24mm)	-	8.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
659-65ABT1E HEATSINK EXTRUSION 37MM Wakefield-Vette	3,794	-	RFQ	Datasheet	659	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.450" (36.83mm)	1.450" (36.83mm)	-	0.650" (16.51mm)	2.0W @ 20°C	1.50°C/W @ 600 LFM	-	Aluminum	Black Anodized
655-26ABT4E HEATSINK FOR 40MM BGA Wakefield-Vette	3,160	-	RFQ	Datasheet	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.260" (6.60mm)	5.0W @ 60°C	3.00°C/W @ 500 LFM	-	Aluminum	Black Anodized

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