Chip Quik Inc. ESD-FOAM-PINK-24X18X0.5
PINK ESD FOAM, LEAD INSERTION GR
Answer first: this page is a purchasing reference for the exact part number ESD-FOAM-PINK-24X18X0.5 from Chip Quik Inc.. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.
Key Parameters
| Part Number | ESD-FOAM-PINK-24X18X0.5 |
|---|---|
| Manufacturer | Chip Quik Inc. |
| Category | Foam |
| series | CHIPQUIK® |
| packaging | Bulk |
| product status | Active |
| param 1 | 18.00" W x 24.00" L (457.2mm x 609.6mm) |
| param 2 | 0.500" (12.70mm) |
| param 3 | - |
| param 4 | Polyethylene |
| param 5 | - |
| param 6 | Pink |
Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.
How to Verify ESD-FOAM-PINK-24X18X0.5 Before Ordering
Datasheet and parameter checks
- Confirm the full manufacturer part number, not only a shortened search keyword.
- Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
- Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.
RFQ fields SENICO needs
- Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
- State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
- Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.
For ESD-FOAM-PINK-24X18X0.5, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.
We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.
Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.