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CML Micro FX614P3

BELL 202 COMPATIBLE MODEM

Answer first: this page is a purchasing reference for the exact part number FX614P3 from CML Micro. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: CML Micro Category: Modems - ICs and Modules Part number: FX614P3 Package: 16-DIP (0.300", 7.62mm) RFQ verification required

Key Parameters

Part NumberFX614P3
ManufacturerCML Micro
CategoryModems - ICs and Modules
package16-DIP (0.300", 7.62mm)
series-
packagingTube
product statusObsolete
param 1FSK, Bell 202
param 21.2k
param 33V ~ 5.5V
param 4Through Hole
param 516-PDIP

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify FX614P3 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For FX614P3, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.