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Davies Molding, LLC 0055EZ

50MM M16X2.0 THERMOSET BALL KNOB

Answer first: this page is a purchasing reference for the exact part number 0055EZ from Davies Molding, LLC. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Davies Molding, LLC Category: Knobs Part number: 0055EZ Package: RFQ verification required

Key Parameters

Part Number0055EZ
ManufacturerDavies Molding, LLC
CategoryKnobs
series0055
packagingBulk
product statusActive
param 1Ball
param 2Smooth
param 3-
param 41.969" (50.00mm)
param 5-
param 6No Indicator
param 7Phenolic
param 8Black
param 9-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 0055EZ Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 0055EZ, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.