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Deca CTR2.5

TERM BLK SCREW 20PCS BUNDLE

Answer first: this page is a purchasing reference for the exact part number CTR2.5 from Deca. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Deca Part number: CTR2.5 Package: RFQ verification required

Key Parameters

Part NumberCTR2.5
ManufacturerDeca
CategoryDin Rail, Channel
seriesDECA-DRTB
packagingBulk
product statusActive
param 1Disconnect
param 2Switch, Lever
param 32
param 41
param 55.0mm
param 6Screw
param 7-
param 8500V
param 912 A
param 10600V
param 1112-22 AWG
param 120.5-2.5mm²
param 13-
param 14Beige
param 15-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify CTR2.5 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For CTR2.5, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.