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Essentra Components 60SGN03300

GROMMET NUT, .300 HOLE DIA, .031

Answer first: this page is a purchasing reference for the exact part number 60SGN03300 from Essentra Components. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Essentra Components Part number: 60SGN03300 Package: RFQ verification required

Key Parameters

Part Number60SGN03300
ManufacturerEssentra Components
CategoryScrew Grommets
seriesMicroPlastics
packagingBulk
product statusActive
param 1#6
param 20.485" (12.32mm) Square
param 3-
param 40.055" (1.40mm)
param 5Nylon
param 6Natural

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 60SGN03300 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 60SGN03300, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.