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IDEC BNH50W

BN SERIES TERMINAL BLOCK

Answer first: this page is a purchasing reference for the exact part number BNH50W from IDEC. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: IDEC Category: Din Rail, Channel Part number: BNH50W Package: RFQ verification required

Key Parameters

Part NumberBNH50W
ManufacturerIDEC
CategoryDin Rail, Channel
seriesBNH
packagingBulk
product statusActive
param 1Feed Through
param 2-
param 32
param 41
param 515.5mm
param 6Screw
param 7-
param 8-
param 950 A
param 10600V
param 116-16 AWG
param 12-
param 13-
param 14Black
param 15-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify BNH50W Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For BNH50W, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.