JAE Electronics C2777-JF08R0R041090AA
JF08 HI SPD FLX ASSMBLY 41PINS
Answer first: this page is a purchasing reference for the exact part number C2777-JF08R0R041090AA from JAE Electronics. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.
Key Parameters
| Part Number | C2777-JF08R0R041090AA |
|---|---|
| Manufacturer | JAE Electronics |
| Category | Flat Flex Jumpers, Cables (FFC, FPC) |
| series | JF08 |
| packaging | Box |
| product status | Obsolete |
| param 1 | Receptacle with Latch to Receptacle with Latch |
| param 2 | 35.43" (900.00mm) |
| param 3 | 41 |
| param 4 | 0.020" (0.50mm) |
Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.
How to Verify C2777-JF08R0R041090AA Before Ordering
Datasheet and parameter checks
- Confirm the full manufacturer part number, not only a shortened search keyword.
- Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
- Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.
RFQ fields SENICO needs
- Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
- State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
- Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.
For C2777-JF08R0R041090AA, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.
We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.
Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.