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JAE Electronics MX60S65H4F1

CONN SCKT 0.3-0.5MM2 CRIMP TIN

Answer first: this page is a purchasing reference for the exact part number MX60S65H4F1 from JAE Electronics. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: JAE Electronics Category: Rectangular Connector Contacts Part number: MX60S65H4F1 Package: RFQ verification required

Key Parameters

Part NumberMX60S65H4F1
ManufacturerJAE Electronics
CategoryRectangular Connector Contacts
seriesMX60
packagingTape & Reel (TR)
product statusActive
param 1-
param 2Socket
param 3Crimp
param 420-22 AWG
param 5Tin
param 6-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify MX60S65H4F1 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For MX60S65H4F1, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.