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Molex 0460121141-02-B9

2" PRE-CRIMP A2064 BLACK

Answer first: this page is a purchasing reference for the exact part number 0460121141-02-B9 from Molex. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Molex Part number: 0460121141-02-B9 Package: RFQ verification required

Key Parameters

Part Number0460121141-02-B9
ManufacturerMolex
CategoryJumper Wires, Pre-Crimped Leads
seriesMini-Fit Plus HCS 46012
packagingBulk
product statusActive
param 1Pin to Cable (Round)
param 22.00" (50.80mm)
param 318 AWG
param 4Tin
param 5Black
param 6100.0µin (2.54µm)

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 0460121141-02-B9 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 0460121141-02-B9, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.