NXP USA Inc. UJA1169ATK/FZ
IC MINI-CAN SYSTEM BASIS CHIP
Answer first: this page is a purchasing reference for the exact part number UJA1169ATK/FZ from NXP USA Inc.. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.
Key Parameters
| Part Number | UJA1169ATK/FZ |
|---|---|
| Manufacturer | NXP USA Inc. |
| Category | Specialized |
| package | 20-VFDFN Exposed Pad |
| series | - |
| packaging | Tape & Reel (TR) |
| product status | Active |
| param 1 | System Basis Chip |
| param 2 | CAN, SPI |
| param 3 | 3V ~ 28V |
| param 4 | 20-HVSON (3.5x5.5) |
| param 5 | - |
| param 6 | - |
| param 7 | Surface Mount |
Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.
How to Verify UJA1169ATK/FZ Before Ordering
Datasheet and parameter checks
- Confirm the full manufacturer part number, not only a shortened search keyword.
- Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
- Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.
RFQ fields SENICO needs
- Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
- State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
- Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.
For UJA1169ATK/FZ, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.
We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.
Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.