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Plazmo Industries 60600100

Screen for Bally iVIEW Hitachi

Answer first: this page is a purchasing reference for the exact part number 60600100 from Plazmo Industries. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Plazmo Industries Category: Touch Screen Overlays Part number: 60600100 Package: RFQ verification required

Key Parameters

Part Number60600100
ManufacturerPlazmo Industries
CategoryTouch Screen Overlays
series-
packagingBulk
product statusActive
param 15.94" (151.00mm)
param 2-
param 32.18" (55.50mm)
param 45-Wire
param 5Resistive
param 66.2" (157.48mm)

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 60600100 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 60600100, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.