Seek Thermal S306SP
THERMAL IMAGING KIT 320X240, 35D
Answer first: this page is a purchasing reference for the exact part number S306SP from Seek Thermal. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.
Key Parameters
| Part Number | S306SP |
|---|---|
| Manufacturer | Seek Thermal |
| Category | Image Sensors, Camera |
| package | Module |
| series | Mosaic Core |
| packaging | Box |
| product status | Active |
| param 1 | Thermal |
| param 2 | 12µm x 12µm |
| param 3 | 320H x 240V |
| param 4 | 9.0 |
| param 5 | 3.3V ~ 5V |
| param 6 | Module |
| param 7 | -10°C ~ 60°C |
| param 8 | - |
| param 9 | - |
Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.
How to Verify S306SP Before Ordering
Datasheet and parameter checks
- Confirm the full manufacturer part number, not only a shortened search keyword.
- Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
- Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.
RFQ fields SENICO needs
- Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
- State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
- Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.
For S306SP, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.
We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.
Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.