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SICK, Inc. 1030050

ABSOL LINEAR ENCODER

Answer first: this page is a purchasing reference for the exact part number 1030050 from SICK, Inc.. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: SICK, Inc. Part number: 1030050 Package: RFQ verification required

Key Parameters

Part Number1030050
ManufacturerSICK, Inc.
CategoryEncoders
seriesKH53
packagingBulk
product statusActive
param 1-
param 2Magnetic
param 3SSI
param 4-
param 510V ~ 32V
param 6Shaft
param 7No
param 8No
param 9Flange Mount
param 10User Selectable
param 11Cable
param 12-
param 13-
param 14-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 1030050 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 1030050, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.