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SICK, Inc. 2113237

TPE/4*2*0,14/BU/SH

Answer first: this page is a purchasing reference for the exact part number 2113237 from SICK, Inc.. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: SICK, Inc. Category: Between Series Adapter Cables Part number: 2113237 Package: RFQ verification required

Key Parameters

Part Number2113237
ManufacturerSICK, Inc.
CategoryBetween Series Adapter Cables
series-
packagingBulk
product statusActive
param 1Circular 08 pos Male to RJ45, 8p8c
param 232.81' (10.00m)
param 3Round
param 4Turquoise
param 5Shielded
param 6-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 2113237 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 2113237, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.