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Silvertel AG1171

LOW COST RINGING SLIC WITH DC-DC

Answer first: this page is a purchasing reference for the exact part number AG1171 from Silvertel. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Silvertel Category: Telecom Part number: AG1171 Package: 14-SIP Module RFQ verification required

Key Parameters

Part NumberAG1171
ManufacturerSilvertel
CategoryTelecom
package14-SIP Module
seriesAg1171
packagingTray
product statusActive
param 1-
param 2SLIC
param 3-
param 43.3V ~ 5V
param 560mA
param 61.2 W
param 70°C ~ 70°C
param 8-
param 9-
param 10Through Hole
param 1114-SIP

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify AG1171 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For AG1171, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.