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TE Application Tooling 48819

DIE SOLIS 69060 500-600MCM

Answer first: this page is a purchasing reference for the exact part number 48819 from TE Application Tooling. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: TE Application Tooling Category: Crimp Heads, Die Sets Part number: 48819 Package: RFQ verification required

Key Parameters

Part Number48819
ManufacturerTE Application Tooling
CategoryCrimp Heads, Die Sets
seriesSolistrand
packagingBulk
product statusActive
param 1Die Set, Hydraulic
param 2Splices and Terminals, 500-600MCM
param 3-
param 458445-1, 1752788-1
param 5-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 48819 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 48819, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.