TE Application Tooling 58552-1
DIE SET F/OPTIC FSMA USE W/A9996
Answer first: this page is a purchasing reference for the exact part number 58552-1 from TE Application Tooling. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.
Key Parameters
| Part Number | 58552-1 |
|---|---|
| Manufacturer | TE Application Tooling |
| Category | Crimp Heads, Die Sets |
| series | Pro-Crimper III, OPTIMATE |
| packaging | Bulk |
| product status | Active |
| param 1 | Die Set |
| param 2 | Fiber Optics - ST |
| param 3 | Hex - 0.128", 0.151", 0.172", 0.204" |
| param 4 | 58532-1 |
| param 5 | Cable - 3.0mm Dia |
Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.
How to Verify 58552-1 Before Ordering
Datasheet and parameter checks
- Confirm the full manufacturer part number, not only a shortened search keyword.
- Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
- Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.
RFQ fields SENICO needs
- Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
- State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
- Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.
For 58552-1, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.
We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.
Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.