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Weidmüller 997704

TERM BLK 23P SIDE ENT 5.08MM PCB

Answer first: this page is a purchasing reference for the exact part number 997704 from Weidmüller. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Weidmüller Category: Wire to Board Part number: 997704 Package: RFQ verification required

Key Parameters

Part Number997704
ManufacturerWeidmüller
CategoryWire to Board
seriesOmnimate LP
packagingBulk
product statusObsolete
param 12
param 223
param 30.200" (5.08mm)
param 4Horizontal with Board
param 5-
param 6-
param 7-
param 8Through Hole
param 9-
param 10-
param 11Orange

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify 997704 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For 997704, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.