Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    114-87-428-41-117101

    114-87-428-41-117101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,737
    RFQ
    114-87-428-41-117101

    Datasheet

    114-87-428-41-117101 114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-318-41-105191

    110-87-318-41-105191

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,106
    RFQ

    -

    110-87-318-41-105191 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-314-31-012101

    614-83-314-31-012101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,318
    RFQ
    614-83-314-31-012101

    Datasheet

    614-83-314-31-012101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-328-41-003101

    115-87-328-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,270
    RFQ
    115-87-328-41-003101

    Datasheet

    115-87-328-41-003101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-88-028-24-008

    540-88-028-24-008

    CONN SOCKET PLCC 28POS TIN

    Preci-Dip

    2,395
    RFQ
    540-88-028-24-008

    Datasheet

    540-88-028-24-008 540 Bulk Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    121-83-312-41-001101

    121-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,164
    RFQ
    121-83-312-41-001101

    Datasheet

    121-83-312-41-001101 121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-420-41-001101

    115-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,638
    RFQ

    -

    115-83-420-41-001101 115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-037-10-061101

    510-87-037-10-061101

    CONN SOCKET PGA 37POS GOLD

    Preci-Dip

    3,698
    RFQ
    510-87-037-10-061101

    Datasheet

    510-87-037-10-061101 510 Bulk Active PGA 37 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0110-TT-2

    HLS-0110-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,577
    RFQ
    HLS-0110-TT-2

    Datasheet

    HLS-0110-TT-2 HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    08-2513-11

    08-2513-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,788
    RFQ
    08-2513-11

    Datasheet

    08-2513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0513-10H

    09-0513-10H

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    4,207
    RFQ
    09-0513-10H

    Datasheet

    09-0513-10H 0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    07-0518-11H

    07-0518-11H

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    4,675
    RFQ
    07-0518-11H

    Datasheet

    07-0518-11H 518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    15-0518-10H

    15-0518-10H

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,755
    RFQ
    15-0518-10H

    Datasheet

    15-0518-10H 518 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-0518-10T

    16-0518-10T

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    3,746
    RFQ
    16-0518-10T

    Datasheet

    16-0518-10T 518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-1518-10

    18-1518-10

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,466
    RFQ
    18-1518-10

    Datasheet

    18-1518-10 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    540-88-032-24-008

    540-88-032-24-008

    CONN SOCKET PLCC 32POS TIN

    Preci-Dip

    2,090
    RFQ
    540-88-032-24-008

    Datasheet

    540-88-032-24-008 540 Bulk Active PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    10-3513-10T

    10-3513-10T

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,052
    RFQ
    10-3513-10T

    Datasheet

    10-3513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    AR28-HZL/07-TT

    AR28-HZL/07-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    2,991
    RFQ
    AR28-HZL/07-TT

    Datasheet

    AR28-HZL/07-TT - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    117-83-620-41-005101

    117-83-620-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,798
    RFQ
    117-83-620-41-005101

    Datasheet

    117-83-620-41-005101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D0816-01

    D0816-01

    CONN IC DIP SOCKET 16POS GOLD

    Harwin Inc.

    2,020
    RFQ
    D0816-01

    Datasheet

    D0816-01 D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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