Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    122-87-316-41-001101

    122-87-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,704
    RFQ
    122-87-316-41-001101

    Datasheet

    122-87-316-41-001101 122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-422-41-105101

    110-87-422-41-105101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,459
    RFQ
    110-87-422-41-105101

    Datasheet

    110-87-422-41-105101 110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    130-028-050

    130-028-050

    CONN IC DIP SOCKET 28POS GOLD

    3M

    2,184
    RFQ
    130-028-050

    Datasheet

    130-028-050 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    110-83-316-41-105101

    110-83-316-41-105101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,539
    RFQ
    110-83-316-41-105101

    Datasheet

    110-83-316-41-105101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-83-108-41-005101

    917-83-108-41-005101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    2,150
    RFQ
    917-83-108-41-005101

    Datasheet

    917-83-108-41-005101 917 Bulk Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SMPX-44LCC-P

    SMPX-44LCC-P

    SMT PLCC SOCKET 44P POLARISED RO

    Kycon, Inc.

    4,127
    RFQ
    SMPX-44LCC-P

    Datasheet

    SMPX-44LCC-P SMPX Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    HLS-0104-G-2

    HLS-0104-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,188
    RFQ
    HLS-0104-G-2

    Datasheet

    HLS-0104-G-2 HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    540-99-068-17-400000

    540-99-068-17-400000

    CONN SOCKET PLCC 68POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    4,558
    RFQ
    540-99-068-17-400000

    Datasheet

    540-99-068-17-400000 540 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    540-99-068-17-400200

    540-99-068-17-400200

    CONN SOCKET PLCC 68POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,230
    RFQ
    540-99-068-17-400200

    Datasheet

    540-99-068-17-400200 540 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    116-83-314-41-003101

    116-83-314-41-003101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,473
    RFQ
    116-83-314-41-003101

    Datasheet

    116-83-314-41-003101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-318-41-117101

    114-83-318-41-117101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,675
    RFQ
    114-83-318-41-117101

    Datasheet

    114-83-318-41-117101 114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-318-41-134161

    114-83-318-41-134161

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,956
    RFQ
    114-83-318-41-134161

    Datasheet

    114-83-318-41-134161 114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-0513-10T

    14-0513-10T

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    2,757
    RFQ
    14-0513-10T

    Datasheet

    14-0513-10T 0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-0518-10

    18-0518-10

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,915
    RFQ
    18-0518-10

    Datasheet

    18-0518-10 518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-428-41-003101

    115-87-428-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,305
    RFQ
    115-87-428-41-003101

    Datasheet

    115-87-428-41-003101 115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR28-HZW/T

    AR28-HZW/T

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    4,781
    RFQ
    AR28-HZW/T

    Datasheet

    AR28-HZW/T - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    SIP1X32-001B

    SIP1X32-001B

    SIP1X32-001B-SIP SOCKET 32 POS

    Amphenol ICC (FCI)

    2,990
    RFQ
    SIP1X32-001B

    Datasheet

    SIP1X32-001B SIP1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    614-87-320-31-012101

    614-87-320-31-012101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,605
    RFQ
    614-87-320-31-012101

    Datasheet

    614-87-320-31-012101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-420-31-012101

    614-87-420-31-012101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,059
    RFQ
    614-87-420-31-012101

    Datasheet

    614-87-420-31-012101 614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    643644-6

    643644-6

    CONN SOCKET SIP 12POS TIN

    TE Connectivity AMP Connectors

    2,478
    RFQ
    643644-6

    Datasheet

    643644-6 Diplomate DL Tray Obsolete SIP 12 (1 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 143144145146147148149150...955Next»
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