Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    AR 36-HZL/01-TT

    AR 36-HZL/01-TT

    SOCKET

    Assmann WSW Components

    4,917
    RFQ

    -

    AR 36-HZL/01-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    612-83-314-41-001101

    612-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,569
    RFQ
    612-83-314-41-001101

    Datasheet

    612-83-314-41-001101 612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-312-41-001101

    116-87-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,094
    RFQ
    116-87-312-41-001101

    Datasheet

    116-87-312-41-001101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-3513-10

    14-3513-10

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,761
    RFQ
    14-3513-10

    Datasheet

    14-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    03-0508-20

    03-0508-20

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    3,526
    RFQ
    03-0508-20

    Datasheet

    03-0508-20 508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    HLS-0103-G-11

    HLS-0103-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,346
    RFQ
    HLS-0103-G-11

    Datasheet

    HLS-0103-G-11 HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICF-308-TM-O

    ICF-308-TM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,154
    RFQ
    ICF-308-TM-O

    Datasheet

    ICF-308-TM-O ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    122-87-314-41-001101

    122-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,730
    RFQ
    122-87-314-41-001101

    Datasheet

    122-87-314-41-001101 122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-430-41-005101

    117-87-430-41-005101

    CONN IC DIP SOCKET 30POS GOLD

    Preci-Dip

    4,190
    RFQ
    117-87-430-41-005101

    Datasheet

    117-87-430-41-005101 117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-312-41-001101

    123-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,760
    RFQ
    123-83-312-41-001101

    Datasheet

    123-83-312-41-001101 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-320-41-005101

    110-83-320-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,230
    RFQ
    110-83-320-41-005101

    Datasheet

    110-83-320-41-005101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-320-41-605101

    110-83-320-41-605101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,868
    RFQ
    110-83-320-41-605101

    Datasheet

    110-83-320-41-605101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    17-0518-10

    17-0518-10

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,649
    RFQ
    17-0518-10

    Datasheet

    17-0518-10 518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    114-87-624-41-134161

    114-87-624-41-134161

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,642
    RFQ
    114-87-624-41-134161

    Datasheet

    114-87-624-41-134161 114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    508-AG10D-ESL

    508-AG10D-ESL

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,264
    RFQ
    508-AG10D-ESL

    Datasheet

    508-AG10D-ESL 500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 5.00µin (0.127µm) Brass - -55°C ~ 125°C
    110-83-420-41-005101

    110-83-420-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,393
    RFQ
    110-83-420-41-005101

    Datasheet

    110-83-420-41-005101 110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-422-41-001101

    110-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,175
    RFQ
    110-83-422-41-001101

    Datasheet

    110-83-422-41-001101 110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-328-41-117101

    114-87-328-41-117101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,694
    RFQ
    114-87-328-41-117101

    Datasheet

    114-87-328-41-117101 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    300-032-000

    300-032-000

    CONN SOCKET SIP 32POS GOLD

    3M

    2,946
    RFQ

    -

    300-032-000 300 - Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    116-87-320-41-018101

    116-87-320-41-018101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,648
    RFQ
    116-87-320-41-018101

    Datasheet

    116-87-320-41-018101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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