Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-3513-11

    10-3513-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,624
    RFQ
    10-3513-11

    Datasheet

    10-3513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0513-10H

    17-0513-10H

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    4,215
    RFQ
    17-0513-10H

    Datasheet

    17-0513-10H 0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-C195-10T

    14-C195-10T

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,204
    RFQ
    14-C195-10T

    Datasheet

    14-C195-10T EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-422-41-012101

    116-83-422-41-012101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,373
    RFQ
    116-83-422-41-012101

    Datasheet

    116-83-422-41-012101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-632-41-134191

    114-83-632-41-134191

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,252
    RFQ
    114-83-632-41-134191

    Datasheet

    114-83-632-41-134191 114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3518-11

    20-3518-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,144
    RFQ
    20-3518-11

    Datasheet

    20-3518-11 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-322-41-009101

    116-87-322-41-009101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,964
    RFQ
    116-87-322-41-009101

    Datasheet

    116-87-322-41-009101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-424-41-035101

    146-87-424-41-035101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,386
    RFQ
    146-87-424-41-035101

    Datasheet

    146-87-424-41-035101 146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D01-9951442

    D01-9951442

    CONN SOCKET SIP 14POS GOLD

    Harwin Inc.

    3,040
    RFQ
    D01-9951442

    Datasheet

    D01-9951442 D01-995 Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    818-AG10D

    818-AG10D

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    3,040
    RFQ
    818-AG10D

    Datasheet

    818-AG10D 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    116-87-328-41-012101

    116-87-328-41-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,080
    RFQ
    116-87-328-41-012101

    Datasheet

    116-87-328-41-012101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-83-422-41-001101

    122-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,280
    RFQ
    122-83-422-41-001101

    Datasheet

    122-83-422-41-001101 122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-422-41-001101

    123-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,161
    RFQ
    123-83-422-41-001101

    Datasheet

    123-83-422-41-001101 123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-314-41-004101

    116-83-314-41-004101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,962
    RFQ
    116-83-314-41-004101

    Datasheet

    116-83-314-41-004101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-316-41-011101

    116-83-316-41-011101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,330
    RFQ
    116-83-316-41-011101

    Datasheet

    116-83-316-41-011101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C9114-00

    C9114-00

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,764
    RFQ
    C9114-00

    Datasheet

    C9114-00 Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    34-1518-10

    34-1518-10

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    2,833
    RFQ
    34-1518-10

    Datasheet

    34-1518-10 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    09-0517-90C

    09-0517-90C

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,871
    RFQ
    09-0517-90C

    Datasheet

    09-0517-90C 0517 Bulk Active SIP 9 (1 x 9) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0205-T-22

    HLS-0205-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,858
    RFQ
    HLS-0205-T-22

    Datasheet

    HLS-0205-T-22 HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    1050282031

    1050282031

    CONN CAMERA SOCKET 32POS GOLD

    Molex

    3,673
    RFQ
    1050282031

    Datasheet

    1050282031 105028 Tape & Reel (TR) Obsolete Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold Flash Copper Alloy Plastic -
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