Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-87-422-41-009101

    116-87-422-41-009101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,863
    RFQ
    116-87-422-41-009101

    Datasheet

    116-87-422-41-009101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-AG12D-LF

    514-AG12D-LF

    CONN IC DIP SOCKET 14POS TIN

    TE Connectivity AMP Connectors

    2,403
    RFQ
    514-AG12D-LF

    Datasheet

    514-AG12D-LF 500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    22-3513-10

    22-3513-10

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,424
    RFQ
    22-3513-10

    Datasheet

    22-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-210-41-013101

    116-83-210-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,913
    RFQ
    116-83-210-41-013101

    Datasheet

    116-83-210-41-013101 116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-640-41-001151

    110-83-640-41-001151

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,292
    RFQ

    -

    110-83-640-41-001151 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-328-41-006101

    116-83-328-41-006101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,722
    RFQ
    116-83-328-41-006101

    Datasheet

    116-83-328-41-006101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-0513-10

    24-0513-10

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,736
    RFQ
    24-0513-10

    Datasheet

    24-0513-10 0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0203-G-11

    HLS-0203-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,511
    RFQ
    HLS-0203-G-11

    Datasheet

    HLS-0203-G-11 HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-83-420-41-008101

    116-83-420-41-008101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,347
    RFQ
    116-83-420-41-008101

    Datasheet

    116-83-420-41-008101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 28-HZL/01-7-TT

    AR 28-HZL/01-7-TT

    SOCKET

    Assmann WSW Components

    3,204
    RFQ

    -

    AR 28-HZL/01-7-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    510-87-072-11-001101

    510-87-072-11-001101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    3,977
    RFQ
    510-87-072-11-001101

    Datasheet

    510-87-072-11-001101 510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-072-11-041101

    510-87-072-11-041101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    2,275
    RFQ
    510-87-072-11-041101

    Datasheet

    510-87-072-11-041101 510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-072-11-061101

    510-87-072-11-061101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    3,441
    RFQ
    510-87-072-11-061101

    Datasheet

    510-87-072-11-061101 510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-032-TM-N-TR

    PLCC-032-TM-N-TR

    CONN SOCKET PLCC 32POS TIN

    Samtec Inc.

    2,381
    RFQ
    PLCC-032-TM-N-TR

    Datasheet

    PLCC-032-TM-N-TR PLCC Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    A-ICS-254-20-TT50

    A-ICS-254-20-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,580
    RFQ
    A-ICS-254-20-TT50

    Datasheet

    A-ICS-254-20-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICO-324-STT

    ICO-324-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,759
    RFQ
    ICO-324-STT

    Datasheet

    ICO-324-STT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-624-STT

    ICO-624-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,053
    RFQ
    ICO-624-STT

    Datasheet

    ICO-624-STT ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    12-1518-00

    12-1518-00

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,990
    RFQ
    12-1518-00

    Datasheet

    12-1518-00 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    25-0518-10

    25-0518-10

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    4,793
    RFQ
    25-0518-10

    Datasheet

    25-0518-10 518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-310-41-013101

    116-83-310-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,994
    RFQ
    116-83-310-41-013101

    Datasheet

    116-83-310-41-013101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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