Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    1571541-3

    1571541-3

    CONN SOCKET PLCC 68POS TIN

    TE Connectivity AMP Connectors

    4,793
    RFQ
    1571541-3

    Datasheet

    1571541-3 PCS Bulk Obsolete PLCC 68 (4 x 17) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS) -
    08-3513-10H

    08-3513-10H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,947
    RFQ
    08-3513-10H

    Datasheet

    08-3513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-0513-10T

    19-0513-10T

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    2,357
    RFQ
    19-0513-10T

    Datasheet

    19-0513-10T 0513 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-624-41-007101

    116-87-624-41-007101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,942
    RFQ
    116-87-624-41-007101

    Datasheet

    116-87-624-41-007101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-420-41-001101

    116-87-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,638
    RFQ
    116-87-420-41-001101

    Datasheet

    116-87-420-41-001101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-636-41-005101

    110-83-636-41-005101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,369
    RFQ
    110-83-636-41-005101

    Datasheet

    110-83-636-41-005101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-320-41-008101

    116-83-320-41-008101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,927
    RFQ
    116-83-320-41-008101

    Datasheet

    116-83-320-41-008101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-320-41-035101

    146-83-320-41-035101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,528
    RFQ
    146-83-320-41-035101

    Datasheet

    146-83-320-41-035101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-420-41-035101

    146-83-420-41-035101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,861
    RFQ
    146-83-420-41-035101

    Datasheet

    146-83-420-41-035101 146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-420-41-036101

    146-83-420-41-036101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,720
    RFQ
    146-83-420-41-036101

    Datasheet

    146-83-420-41-036101 146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-322-41-001101

    121-83-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,019
    RFQ
    121-83-322-41-001101

    Datasheet

    121-83-322-41-001101 121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-422-41-003101

    116-83-422-41-003101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,936
    RFQ
    116-83-422-41-003101

    Datasheet

    116-83-422-41-003101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    15-0513-11H

    15-0513-11H

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,620
    RFQ
    15-0513-11H

    Datasheet

    15-0513-11H 0513 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-0513-11

    18-0513-11

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,294
    RFQ
    18-0513-11

    Datasheet

    18-0513-11 0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0518-11

    23-0518-11

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,606
    RFQ
    23-0518-11

    Datasheet

    23-0518-11 518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-0518-10

    34-0518-10

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    2,151
    RFQ
    34-0518-10

    Datasheet

    34-0518-10 518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APA-308-T-N

    APA-308-T-N

    ADAPTER PLUG

    Samtec Inc.

    3,936
    RFQ
    APA-308-T-N

    Datasheet

    APA-308-T-N APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    HLS-0108-T-10

    HLS-0108-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,228
    RFQ
    HLS-0108-T-10

    Datasheet

    HLS-0108-T-10 HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    346-93-108-41-013000

    346-93-108-41-013000

    CONN SOCKET SIP 8POS GOLD

    Mill-Max Manufacturing Corp.

    3,331
    RFQ
    346-93-108-41-013000

    Datasheet

    346-93-108-41-013000 346 Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-108-41-013000

    346-43-108-41-013000

    CONN SOCKET SIP 8POS GOLD

    Mill-Max Manufacturing Corp.

    4,971
    RFQ
    346-43-108-41-013000

    Datasheet

    346-43-108-41-013000 346 Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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