Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    HLS-0204-G-2

    HLS-0204-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,515
    RFQ
    HLS-0204-G-2

    Datasheet

    HLS-0204-G-2 HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICA-308-ZSGT-L

    ICA-308-ZSGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,145
    RFQ
    ICA-308-ZSGT-L

    Datasheet

    ICA-308-ZSGT-L ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    26-1518-10

    26-1518-10

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    4,176
    RFQ
    26-1518-10

    Datasheet

    26-1518-10 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    114-83-636-41-117101

    114-83-636-41-117101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,450
    RFQ
    114-83-636-41-117101

    Datasheet

    114-83-636-41-117101 114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-002101

    116-87-328-41-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,720
    RFQ
    116-87-328-41-002101

    Datasheet

    116-87-328-41-002101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1571552-2

    1-1571552-2

    CONN IC DIP SOCKET 40POS TIN

    TE Connectivity AMP Connectors

    4,249
    RFQ
    1-1571552-2

    Datasheet

    1-1571552-2 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    13-0513-11H

    13-0513-11H

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,088
    RFQ
    13-0513-11H

    Datasheet

    13-0513-11H 0513 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-420-41-009101

    116-83-420-41-009101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,689
    RFQ
    116-83-420-41-009101

    Datasheet

    116-83-420-41-009101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-ZSST

    ICA-314-ZSST

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,185
    RFQ
    ICA-314-ZSST

    Datasheet

    ICA-314-ZSST ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-ZSST

    ICO-314-ZSST

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,857
    RFQ
    ICO-314-ZSST

    Datasheet

    ICO-314-ZSST ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    115-87-950-41-001101

    115-87-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,728
    RFQ

    -

    115-87-950-41-001101 115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-610-41-013101

    116-83-610-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,067
    RFQ
    116-83-610-41-013101

    Datasheet

    116-83-610-41-013101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-316-T-J

    APA-316-T-J

    ADAPTER PLUG

    Samtec Inc.

    2,154
    RFQ
    APA-316-T-J

    Datasheet

    APA-316-T-J APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    6-1437529-6

    6-1437529-6

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    2,568
    RFQ
    6-1437529-6

    Datasheet

    6-1437529-6 500 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 47.2µin (1.20µm) Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
    510-87-085-11-045101

    510-87-085-11-045101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    4,377
    RFQ
    510-87-085-11-045101

    Datasheet

    510-87-085-11-045101 510 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-44-084-17-400000

    540-44-084-17-400000

    CONN SOCKET PLCC 84POS TIN

    Mill-Max Manufacturing Corp.

    1
    RFQ
    540-44-084-17-400000

    Datasheet

    540-44-084-17-400000 540 Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    116-83-328-41-018101

    116-83-328-41-018101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,183
    RFQ
    116-83-328-41-018101

    Datasheet

    116-83-328-41-018101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-318-41-801101

    110-83-318-41-801101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,785
    RFQ
    110-83-318-41-801101

    Datasheet

    110-83-318-41-801101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3513-10

    18-3513-10

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,374
    RFQ
    18-3513-10

    Datasheet

    18-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6513-11

    10-6513-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,515
    RFQ
    10-6513-11

    Datasheet

    10-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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