Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    06-0503-31

    06-0503-31

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,108
    RFQ
    06-0503-31

    Datasheet

    06-0503-31 0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-4518-10H

    22-4518-10H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,689
    RFQ
    22-4518-10H

    Datasheet

    22-4518-10H 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-0518-00

    22-0518-00

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    2,119
    RFQ
    22-0518-00

    Datasheet

    22-0518-00 518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-1518-00

    22-1518-00

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,526
    RFQ
    22-1518-00

    Datasheet

    22-1518-00 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-964-41-001101

    115-87-964-41-001101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    3,273
    RFQ

    -

    115-87-964-41-001101 115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    31-0518-10T

    31-0518-10T

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    3,785
    RFQ
    31-0518-10T

    Datasheet

    31-0518-10T 518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-642-31-012101

    614-87-642-31-012101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,110
    RFQ
    614-87-642-31-012101

    Datasheet

    614-87-642-31-012101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    17-0513-11H

    17-0513-11H

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    4,194
    RFQ
    17-0513-11H

    Datasheet

    17-0513-11H 0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    39-0518-10H

    39-0518-10H

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    3,642
    RFQ
    39-0518-10H

    Datasheet

    39-0518-10H 518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    117-83-432-41-105101

    117-83-432-41-105101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,626
    RFQ
    117-83-432-41-105101

    Datasheet

    117-83-432-41-105101 117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-43-109-31-018000

    714-43-109-31-018000

    CONN SOCKET SIP 9POS GOLD

    Mill-Max Manufacturing Corp.

    2,204
    RFQ
    714-43-109-31-018000

    Datasheet

    714-43-109-31-018000 714 Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-314-T-A1

    APO-314-T-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,140
    RFQ
    APO-314-T-A1

    Datasheet

    APO-314-T-A1 APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    HLS-0207-TT-12

    HLS-0207-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,092
    RFQ
    HLS-0207-TT-12

    Datasheet

    HLS-0207-TT-12 HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    299-87-318-10-001101

    299-87-318-10-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,038
    RFQ
    299-87-318-10-001101

    Datasheet

    299-87-318-10-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-648-41-001101

    115-83-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,916
    RFQ

    -

    115-83-648-41-001101 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-065-10-051101

    510-83-065-10-051101

    CONN SOCKET PGA 65POS GOLD

    Preci-Dip

    3,466
    RFQ
    510-83-065-10-051101

    Datasheet

    510-83-065-10-051101 510 Bulk Active PGA 65 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0304-T-10

    HLS-0304-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,580
    RFQ
    HLS-0304-T-10

    Datasheet

    HLS-0304-T-10 HLS Tube Active SIP 12 (3 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-316-41-013101

    116-87-316-41-013101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,501
    RFQ
    116-87-316-41-013101

    Datasheet

    116-87-316-41-013101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-3518-102

    14-3518-102

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,767
    RFQ
    14-3518-102

    Datasheet

    14-3518-102 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-3518-111

    14-3518-111

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,329
    RFQ
    14-3518-111

    Datasheet

    14-3518-111 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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